Roger Howe
William E. Ayer Professor in Electrical Engineering
Bio
Design and fabrication of sensors and actuators using micro and nanotechnologies, with applications to information processing and energy conversion.
Academic Appointments
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Professor, Electrical Engineering
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Member, Bio-X
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Member, Stanford Neurosciences Institute
Administrative Appointments
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Faculty Director, Stanford Nanofabrication Facility (2009 - Present)
Boards, Advisory Committees, Professional Organizations
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Member, National Academy of Engineering (2005 - Present)
Professional Education
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PhD, UC Berkeley (1984)
2015-16 Courses
- Advanced Nanofabrication Laboratory
EE 412 (Aut) - An Intro to Making: What is EE
ENGR 40M (Spr) - Integrated Circuit Fabrication Laboratory
EE 410 (Win) - Introductory Electronics
OSPBER 40B (Win) - Introductory Electronics
OSPPARIS 40P (Aut) -
Independent Studies (7)
- Master's Thesis and Thesis Research
EE 300 (Aut, Win, Spr, Sum) - Practical Training
PHYSICS 291 (Sum) - Special Studies and Reports in Electrical Engineering
EE 191 (Aut, Win, Spr) - Special Studies and Reports in Electrical Engineering
EE 391 (Aut, Win, Spr, Sum) - Special Studies and Reports in Electrical Engineering (WIM)
EE 191W (Aut, Win, Spr) - Special Studies or Projects in Electrical Engineering
EE 190 (Aut, Win, Spr) - Special Studies or Projects in Electrical Engineering
EE 390 (Aut, Win, Spr, Sum)
- Master's Thesis and Thesis Research
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Prior Year Courses
2014-15 Courses
- Advanced Nanofabrication Laboratory
EE 412 (Aut, Spr) - An Intro to Making: What is EE
ENGR 40M (Spr) - Introductory Electronics
OSPBER 40B (Aut, Win) - Introductory Electronics
OSPPARIS 40P (Aut)
2013-14 Courses
- Advanced Nanofabrication Laboratory
EE 412 (Spr) - Introductory Electronics
ENGR 40 (Aut) - Introductory Electronics
ENGR 40A (Aut) - Introductory Electronics
OSPBER 40B (Aut, Win) - Introductory Electronics
OSPPARIS 40P (Aut) - Principles and Models of Semiconductor Devices
EE 216 (Win)
2012-13 Courses
- Introductory Electronics
OSPBER 40B (Aut, Win) - Introductory Electronics
OSPPARIS 40P (Aut)
- Advanced Nanofabrication Laboratory
All Publications
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Microfabricated Thermally Isolated Low Work-Function Emitter
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2014; 23 (5): 1182-1187
View details for DOI 10.1109/JMEMS.2014.2307882
View details for Web of Science ID 000343318500019
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Inherent Enhancement of Electronic Emission from Hexaboride Heterostructure
PHYSICAL REVIEW APPLIED
2014; 2 (2)
View details for DOI 10.1103/PhysRevApplied.2.024004
View details for Web of Science ID 000344331500001
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Improved Performance of Bottom-Contact Organic Thin-Film Transistor Using Al Doped HfO2 Gate Dielectric
IEEE TRANSACTIONS ON ELECTRON DEVICES
2014; 61 (7): 2398-2403
View details for DOI 10.1109/TED.2014.2325042
View details for Web of Science ID 000338027200024
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Optical MEMS: From Micromirrors to Complex Systems
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2014; 23 (3): 517-538
View details for DOI 10.1109/JMEMS.2014.2319266
View details for Web of Science ID 000337128200007
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DFT Study of Atomically-Modified Alkali-Earth Metal Oxide Films on Tungsten
JOURNAL OF PHYSICAL CHEMISTRY C
2014; 118 (21): 11303-11309
View details for DOI 10.1021/jp4120578
View details for Web of Science ID 000336771700017
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Double-Layer Silicon Photonic Crystal Fiber-Tip Temperature Sensors
IEEE PHOTONICS TECHNOLOGY LETTERS
2014; 26 (9): 900-903
View details for DOI 10.1109/LPT.2014.2309345
View details for Web of Science ID 000335819300003
- Photonic crystal mirrors for free-space communication and fiber-optic sensors
- Epitaxial silicon microshell vacuum-encapsulated CMOS-compatible 200 MHz bulk-mode resonator
- Wafer scale encapsulation of large lateral deflection MEMS structures
- Fully differential interal electrostatic transduction of a Lamé-mode resonator
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Vacuum encapsulated resonators for humidity measurement
SENSORS AND ACTUATORS B-CHEMICAL
2013; 185: 575-581
View details for DOI 10.1016/j.snb.2013.05.016
View details for Web of Science ID 000321509600077
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Laterally Actuated Platinum-Coated Polysilicon NEM Relays
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2013; 22 (3): 768-778
View details for DOI 10.1109/JMEMS.2013.2244779
View details for Web of Science ID 000319827700029
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Thermionic current densities from first principles.
journal of chemical physics
2013; 138 (20): 204701-?
Abstract
We present a density functional theory-based method for calculating thermionic emission currents from a cathode into vacuum using a non-equilibrium Green's function approach. It does not require semi-classical approximations or crude simplifications of the electronic structure used in previous methods and thus provides quantitative predictions of thermionic emission for adsorbate-coated surfaces. The obtained results match well with experimental measurements of temperature-dependent current densities. Our approach can thus enable computational design of composite electrode materials.
View details for DOI 10.1063/1.4805002
View details for PubMedID 23742494
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Thermionic current densities from first principles
JOURNAL OF CHEMICAL PHYSICS
2013; 138 (20)
View details for DOI 10.1063/1.4805002
View details for Web of Science ID 000320131100049
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Combinational Logic Design Using Six-Terminal NEM Relays
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
2013; 32 (5): 653-666
View details for DOI 10.1109/TCAD.2012.2232707
View details for Web of Science ID 000318163800001
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Photon-enhanced thermionic emission from heterostructures with low interface recombination.
Nature communications
2013; 4: 1576-?
Abstract
Photon-enhanced thermionic emission is a method of solar-energy conversion that promises to combine photon and thermal processes into a single mechanism, overcoming fundamental limits on the efficiency of photovoltaic cells. Photon-enhanced thermionic emission relies on vacuum emission of photoexcited electrons that are in thermal equilibrium with a semiconductor lattice, avoiding challenging non-equilibrium requirements and exotic material properties. However, although previous work demonstrated the photon-enhanced thermionic emission effect, efficiency has until now remained very low. Here we describe electron-emission measurements on a GaAs/AlGaAs heterostructure that introduces an internal interface, decoupling the basic physics of photon-enhanced thermionic emission from the vacuum emission process. Quantum efficiencies are dramatically higher than in previous experiments because of low interface recombination and are projected to increase another order of magnitude with more stable, low work-function coatings. The results highlight the effectiveness of the photon-enhanced thermionic emission process and demonstrate that efficient photon-enhanced thermionic emission is achievable, a key step towards realistic photon-enhanced thermionic emission based energy conversion.
View details for DOI 10.1038/ncomms2577
View details for PubMedID 23481384
- Dual-beam six-terminal nanoelectromechanical relays 2013
- Engineering an electrochemical sensor for the characterization of bond vibration frequencies of a chemical analyte. 2013
- Serpentine geometry for enhanced performance of nanometer-thin platinum bolometers 2013
- Ultra-thin atomic layer deposition films for corrosion resistance 2013
- Immobilization of antibodies on solid-state surfaces with controlled orientation using electric field 2013
- Three stage sample preparation for purificaiton of proteins from complex biological samples IEEE Sensors 2013, Baltimore, Maryland 2013: 1-4
- Applications of nanonewton dielectrophoresis forces using atomic layer deposted oxides for microfluidic sample preparation and proteomics 2013
- Ultra dielectrophoresis: electrothermal analysis and its applications in microfluidic sample preparation and proteomics 2013
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Capacitive Accelerometer Laboratory Using Polymer-Film Rapid Prototyping Technology
PROCEEDINGS OF THE 2013 THIRD INTERDISCIPLINARY ENGINEERING DESIGN EDUCATION CONFERENCE (IEDEC 2013)
2013: 79-82
View details for Web of Science ID 000325586800016
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LATERALLY ACTUATED NANOELECTROMECHANICAL RELAYS WITH COMPLIANT, LOW RESISTANCE CONTACT
26TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2013)
2013: 520-523
View details for Web of Science ID 000320549200133
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Microbead-separated thermionic energy converter with enhanced emission current
PHYSICAL CHEMISTRY CHEMICAL PHYSICS
2013; 15 (34): 14442-14446
Abstract
The efficiency of thermionic energy converters is a strong function of the inter-electrode separation due to space-charge limitations. Here we demonstrate vacuum thermionic energy converters constructed using barium dispenser cathodes and thin film tungsten anodes, separated by size specific alumina microbeads for simple device fabrication and inter-electrode gap control. The current and device efficiency at the maximum power point are strongly dependent on the inter-electrode gap, with a maximum device efficiency of 0.61% observed for a gap on the order of 5 μm. Paths to further reductions in space charge and improved anode work function are outlined with potential for over an order of magnitude improvement in output power and efficiency.
View details for DOI 10.1039/c3cp52895b
View details for Web of Science ID 000322725000036
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An orbital-overlap model for minimal work functions of cesiated metal surfaces
JOURNAL OF PHYSICS-CONDENSED MATTER
2012; 24 (44)
Abstract
We introduce a model for the effect of cesium adsorbates on the work function of transition metal surfaces. The model builds on the classical point-dipole equation by adding exponential terms that characterize the degree of orbital overlap between the 6s states of neighboring cesium adsorbates and its effect on the strength and orientation of electric dipoles along the adsorbate-substrate interface. The new model improves upon earlier models in terms of agreement with the work function-coverage curves obtained via first-principles calculations based on density functional theory. All the cesiated metal surfaces have optimal coverages between 0.6 and 0.8 monolayers, in accordance with experimental data. Of all the cesiated metal surfaces that we have considered, tungsten has the lowest minimum work function, also in accordance with experiments.
View details for DOI 10.1088/0953-8984/24/44/445007
View details for Web of Science ID 000310571100009
View details for PubMedID 23018485
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A model for emission yield from planar photocathodes based on photon-enhanced thermionic emission or negative-electron-affinity photoemission
JOURNAL OF APPLIED PHYSICS
2012; 112 (9)
View details for DOI 10.1063/1.4764106
View details for Web of Science ID 000311968400139
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Control of DNA Capture by Nanofluidic Transistors
ACS NANO
2012; 6 (8): 6767-6775
Abstract
We report the use of an array of electrically gated ~200 nm solid-state pores as nanofluidic transistors to manipulate the capture and passage of DNA. The devices are capable of reversibly altering the rate of DNA capture by over 3 orders of magnitude using sub-1 V biasing of a gate electrode. This efficient gating originates from the counter-balance of electrophoresis and electroosmosis, as revealed by quantitative numerical simulations. Such a reversible electronically tunable biomolecular switch may be used to manipulate nucleic acid delivery in a fluidic circuit, and its development is an important first step toward active control of DNA motion through solid-state nanopores for sensing applications.
View details for DOI 10.1021/nn3014917
View details for Web of Science ID 000307988900029
View details for PubMedID 22762282
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Smart-cut layer transfer of single-crystal SiC using spin-on-glass
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2012; 30 (4)
View details for DOI 10.1116/1.4734006
View details for Web of Science ID 000306750700046
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Microencapsulation of silicon cavities using a pulsed excimer laser
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2012; 22 (7)
View details for DOI 10.1088/0960-1317/22/7/075012
View details for Web of Science ID 000305890600026
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Single crystal silicon nanopillars, nanoneedles and nanoblades with precise positioning for massively parallel nanoscale device integration
NANOTECHNOLOGY
2012; 23 (22)
View details for DOI 10.1088/0957-4484/23/22/225303
View details for Web of Science ID 000305160300005
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A dry wafer-reconstitution process with zero insertion force by embedded alignment guide tabs
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2012; 22 (6)
View details for DOI 10.1088/0960-1317/22/6/065007
View details for Web of Science ID 000304609600007
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A micromachining-based technology for enhancing germanium light emission via tensile strain
NATURE PHOTONICS
2012; 6 (6): 398-405
View details for DOI 10.1038/NPHOTON.2012.111
View details for Web of Science ID 000304598200018
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Optimal emitter-collector gap for thermionic energy converters
APPLIED PHYSICS LETTERS
2012; 100 (17)
View details for DOI 10.1063/1.4707379
View details for Web of Science ID 000303340300106
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Application of principal component analysis to a full profile correlative analysis of FTIR spectra
SURFACE AND INTERFACE ANALYSIS
2012; 44 (3): 365-371
View details for DOI 10.1002/sia.3813
View details for Web of Science ID 000303250500014
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Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness
NANO LETTERS
2012; 12 (2): 683-686
Abstract
While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.
View details for DOI 10.1021/nl203548w
View details for Web of Science ID 000299967800026
View details for PubMedID 22224582
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Integration of Nanoelectromechanical Relays With Silicon nMOS
IEEE TRANSACTIONS ON ELECTRON DEVICES
2012; 59 (1): 255-258
View details for DOI 10.1109/TED.2011.2172946
View details for Web of Science ID 000298756100038
- CVD hafnium diboride as a contact material for nano-electromechanical switches 2012
- Nano-electro-mechanical relays for FPGA routing: experimental demonstration and a design technique 2012
- Encapsulated thermionic energy converter with stiffened suspension 2012
- Sidewall silicon carbide emitters for terahertz vacuum electronics 2012
- Electrochemical quantum tunneling for electronic detection and characterization of biological toxins 2012
- Multiband charge-coupled device 2012
- Smart-cut layer transfer of single-crystal SiC using spin-on-glass J. Vacuum Sci. Tech. B: Microelectronics and Nanometer Structures 2012; 30: 42001
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Electrochemical quantum tunneling for electronic detection and characterization of biological toxins
MICRO- AND NANOTECHNOLOGY SENSORS, SYSTEMS, AND APPLICATIONS IV
2012; 8373
View details for DOI 10.1117/12.920692
View details for Web of Science ID 000306560400002
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Double-Layer Silicon Photonic Crystal Fiber Tip Temperature Sensor
2012 IEEE PHOTONICS CONFERENCE (IPC)
2012: 550-551
View details for Web of Science ID 000312865000274
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Multiband Charge-Coupled Device
2012 IEEE NUCLEAR SCIENCE SYMPOSIUM AND MEDICAL IMAGING CONFERENCE RECORD (NSS/MIC)
2012: 743-746
View details for Web of Science ID 000326814200155
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Nano-Electro-Mechanical (NEM) Relays and their Application to FPGA Routing
2012 17TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)
2012: 639-639
View details for Web of Science ID 000309240000115
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MICROFABRICATED SILICON CARBIDE THERMIONIC ENERGY CONVERTER FOR SOLAR ELECTRICITY GENERATION
IEEE. 2012
View details for Web of Science ID 000312912800317
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Electrical Properties of CuPc-based OTFTs with Atomic Layer Deposited HfAlO Gate Dielectric
2012 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID STATE CIRCUIT (EDSSC)
2012
View details for Web of Science ID 000318549000101
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Photonic Crystal Fiber Tip Sensor for High-Temperature Measurement
IEEE SENSORS JOURNAL
2011; 11 (11): 2643-2648
View details for DOI 10.1109/JSEN.2011.2153844
View details for Web of Science ID 000304162300004
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Tensile-strained germanium-on-insulator substrate fabrication for silicon-compatible optoelectronics
OPTICAL MATERIALS EXPRESS
2011; 1 (6): 1121-1126
View details for Web of Science ID 000299048700007
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Multilayered Monolithic Silicon Photonic Crystals
IEEE PHOTONICS TECHNOLOGY LETTERS
2011; 23 (11): 730-732
View details for DOI 10.1109/LPT.2011.2132698
View details for Web of Science ID 000290629800008
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Highly Sensitive Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Simultaneous Measurement of Refractive Index and Temperature
JOURNAL OF LIGHTWAVE TECHNOLOGY
2011; 29 (9): 1367-1374
View details for DOI 10.1109/JLT.2011.2126018
View details for Web of Science ID 000289802300007
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AC Polarization for Charge-Drift Elimination in Resonant Electrostatic MEMS and Oscillators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (2): 355-364
View details for DOI 10.1109/JMEMS.2010.2100027
View details for Web of Science ID 000289205400002
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Wafer-Level Epitaxial Silicon Packaging for Out-of-Plane RF MEMS Resonators with Integrated Actuation Electrodes
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2011; 1 (3): 310-317
View details for DOI 10.1109/TCPMT.2010.2100711
View details for Web of Science ID 000292780700004
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Electromechanical Sensing of Charge Retention on Floating Electrodes
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (1): 150-156
View details for DOI 10.1109/JMEMS.2010.2090499
View details for Web of Science ID 000286934900020
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Magnetic, Mechanical, and Optical Characterization of a Magnetic Nanoparticle-Embedded Polymer for Microactuation
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2011; 20 (1): 65-72
View details for DOI 10.1109/JMEMS.2010.2093560
View details for Web of Science ID 000286934900012
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Experimental Demonstration and Analysis of DNA Passage in Nanopore-based Nanofluidic Transistors
2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
2011
View details for Web of Science ID 000300015300178
- A reel-to-reel printed accelerometer 2011
- Low thermal-budget silicon sealed-cavity microencapsulation process 2011
- Spacer technique for low-voltage, high-aspect-ratio lateral electrostatic actuators 2011
- Atomic layer deposition of Al2O3 to protect carbon nanotubes for integration with top-down fabrication 2011
- Effect of illumination on thermionic emission of microfabricated silicon carbide structures 2011
- Dual sidewall lateral nanoelectromechanical relays with beam isolation 2011
- Suppression of wear in cyclically loaded polycrystalline silicon via a thin silicon carbide coating 2011
- Vacuum microsystems for energy conversion and other applications 2011
- Temperature dependence of vacuum encapsulated resonators for humidity measurement 2011
- Double-layered monolithic silicon photonic crystal fiber tip sensor 2011
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Integration of Nanoelectromechanical (NEM) Relays with Silicon CMOS with Functional CMOS-NEM Circuit
2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM)
2011
View details for Web of Science ID 000300015300177
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NANOELECTROMECHANICAL RELAYS WITH DECOUPLED ELECTRODE AND SUSPENSION
2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)
2011: 1361-1364
View details for Web of Science ID 000295841200340
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ALD-METAL UNCOOLED BOLOMETER
2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS)
2011: 676-679
View details for Web of Science ID 000295841200168
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Double-Layer Silicon Photonic Crystal Fiber Tip Sensor
OMN2011: 16TH INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
2011: 97-98
View details for Web of Science ID 000297850100040
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Differential internal dielectric transduction of a Lame-mode resonator
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2010; 20 (11)
View details for DOI 10.1088/0960-1317/20/11/115036
View details for Web of Science ID 000283691600037
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Photon-enhanced thermionic emission for solar concentrator systems
NATURE MATERIALS
2010; 9 (9): 762-767
Abstract
Solar-energy conversion usually takes one of two forms: the 'quantum' approach, which uses the large per-photon energy of solar radiation to excite electrons, as in photovoltaic cells, or the 'thermal' approach, which uses concentrated sunlight as a thermal-energy source to indirectly produce electricity using a heat engine. Here we present a new concept for solar electricity generation, photon-enhanced thermionic emission, which combines quantum and thermal mechanisms into a single physical process. The device is based on thermionic emission of photoexcited electrons from a semiconductor cathode at high temperature. Temperature-dependent photoemission-yield measurements from GaN show strong evidence for photon-enhanced thermionic emission, and calculated efficiencies for idealized devices can exceed the theoretical limits of single-junction photovoltaic cells. The proposed solar converter would operate at temperatures exceeding 200 degrees C, enabling its waste heat to be used to power a secondary thermal engine, boosting theoretical combined conversion efficiencies above 50%.
View details for DOI 10.1038/NMAT2814
View details for Web of Science ID 000281178400029
View details for PubMedID 20676086
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Characterization of Encapsulated Micromechanical Resonators Sealed and Coated With Polycrystalline SiC
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (2): 357-366
View details for DOI 10.1109/JMEMS.2010.2040460
View details for Web of Science ID 000276257700014
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Model and Observations of Dielectric Charge in Thermally Oxidized Silicon Resonators
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (1): 162-174
View details for DOI 10.1109/JMEMS.2009.2036274
View details for Web of Science ID 000274213700016
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A Method for Wafer-Scale Encapsulation of Large Lateral Deflection MEMS Devices
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2010; 19 (1): 28-37
View details for DOI 10.1109/JMEMS.2009.2035717
View details for Web of Science ID 000274213700003
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TITANIUM NITRIDE SIDEWALL STRINGER PROCESS FOR LATERAL NANOELECTROMECHANICAL RELAYS
MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST
2010: 456-459
View details for Web of Science ID 000278416400112
- Time evolution of released hole arrays into membranes via vacuum silicon migration 2010
- Packaging of large lateral deflection MEMS using a combination of fusion bonding and epitaxial reactor sealing 2010
- Four-mask process based on spacer technology for scaled-down electrostatic actuators 2010
- Vacuum encapsulated resonators for humidity measurement 2010
- Heterodyned electrostatic transduction oscillators evade low frequency noise aliasing 2010
- Single-step, wafer-scale, hermetic sealing using silicon migration, to be presented at the 2010
- Composite polysilicon-platinum lateral nanoelectromechanical relays 2010
- 2D analytical model for the study of NEM relay device scaling 2010
- Non-adiabatic electronic relaxation events at monolayer-modified electrode-electrolyte interfaces: physics and applications 2010
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High Temperature Photonic Crystal Fiber Tip Sensor
2010 IEEE SENSORS
2010: 970-974
View details for Web of Science ID 000287982100215
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Monolithic Silicon Photonic Crystal Fiber Tip Sensor for Refractive Index and Temperature Sensing
2010 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) AND QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE (QELS)
2010
View details for Web of Science ID 000290513600412
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Higher-order Dielectrically Transduced Bulk-mode Ring Resonator with Low Motional Resistance
2010 IEEE INTERNATIONAL FREQUENCY CONTROL SYMPOSIUM (FCS)
2010: 19-24
View details for Web of Science ID 000287378700005
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pH Sensor Demonstrating a Layout Programmable Squeeze Pumped Microfluidic Platform
2010 IEEE SENSORS
2010: 936-939
View details for Web of Science ID 000287982100208
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EFFICIENT INTERNAL ELECTROSTATIC TRANSDUCTION OF THE 41(ST) RADIAL MODE OF A RING RESONATOR
MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST
2010: 711-714
View details for Web of Science ID 000278416400176
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CHARGE-DRIFT ELIMINATION IN RESONANT ELECTROSTATIC MEMS
MEMS 2010: 23RD IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST
2010: 108-111
View details for Web of Science ID 000278416400025
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Efficient FPGAs using Nanoelectromechanical Relays
FPGA 10
2010: 273-282
View details for Web of Science ID 000285022000035
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Laser print patterning of planar spiral inductors and interdigitated capacitors
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
2009; 27 (6): 2745-2749
View details for DOI 10.1116/1.3264673
View details for Web of Science ID 000272803400084
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Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2009; 32 (2): 402-409
View details for DOI 10.1109/TADVP.2008.2005114
View details for Web of Science ID 000266778000018
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Photonic Crystal Fiber Tip Sensor for Precision Temperature Sensing
2009 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1AND 2
2009: 761-762
View details for Web of Science ID 000279577600388
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WAFER SCALE ENCAPSULATION OF LARGE LATERAL DEFLECTION MEMS STRUCTURES
IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009)
2009: 745-748
View details for Web of Science ID 000341431500186
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FULLY DIFFERENTIAL INTERNAL ELECTROSTATIC TRANSDUCTION OF A LAME-MODE RESONATOR
IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009)
2009: 931-934
View details for Web of Science ID 000341431500233
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EPITAXIAL SILICON MICROSHELL VACUUM-ENCAPSULATED CMOS-COMPATIBLE 200 MHz BULK-MODE RESONATOR
IEEE 22ND INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2009)
2009: 23-26
View details for Web of Science ID 000341431500006
- Magnetic nanoparticle-driven pumping in microchannels 2009
- Thermionic emission from microfabricated silicon carbide filaments 2009
- Structural transformation of silicon due to hydrogen ambient during germanium epitaxy on silicon nano-pillars 2009
- Nanoelectromechanical (NEM) relays integrated with SRAM for improved stability and low leakage 2009
- Laser print patterning of planar spiral inductors 2009
- Suspended microstructures made using silicon microstructures 2009
- Simultaneous wafer-scale vacuum encapsulation and microstructure cladding with LPCVD polycrystalline 3C-SiC 2009
- Encapsulated out-of-plane differential square-plate resonators with integrated actuation electrodes 2009
- Wafer reconstitution with precision dry front-to-front registration 2009
- Microfluidic device with integrated nanopores for protein detection 2009
- Laser-printed magnetic-polymer microstructures 2009
- Epitaxial growth of graphene on high topology SiC structures patterned by focused ion beam 2009
- Higher-order mode internal electrostatic transduction of a bulk-mode ring resonator on a quartz substrate 2009
- Monolithic Silicon Photonic Crystal Slab Fiber Tip Sensor 2009
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Room-Temperature Wet Etching of Polycrystalline and Nanocrystalline Silicon Carbide Thin Films with HF and HNO3
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2009; 156 (3): D104-D107
View details for DOI 10.1149/1.3061944
View details for Web of Science ID 000265837900044
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Experimental Investigation of Silicon Surface Migration in Low Pressure Nonreducing Gas Environments
ELECTROCHEMICAL AND SOLID STATE LETTERS
2009; 12 (12): H437-H440
View details for DOI 10.1149/1.3236781
View details for Web of Science ID 000270915300022
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Electrical and Mechanical Characterization of Doped and Annealed Polycrystalline 3C-SiC Thin Films
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2009; 156 (1): D5-D10
View details for DOI 10.1149/1.3000002
View details for Web of Science ID 000261209800048
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Characterization of polycrystalline 3C-SiC films deposited from the precursors 1,3-disilabutane and dichlorosilane
JOURNAL OF APPLIED PHYSICS
2008; 103 (8)
View details for DOI 10.1063/1.2907871
View details for Web of Science ID 000255456200180
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Technologies for cofabricating MEMS and electronics
PROCEEDINGS OF THE IEEE
2008; 96 (2): 306-322
View details for DOI 10.1109/JPROC.2007.911064
View details for Web of Science ID 000252583700009
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Effects of annealing on residual stress and strain gradient of doped polycrystalline SiC thin films
ELECTROCHEMICAL AND SOLID STATE LETTERS
2008; 11 (4): D35-D37
View details for DOI 10.1149/1.2831906
View details for Web of Science ID 000253238000009
- Obserations of fixed and mobile charge in composite MEMS resonators 2008
- Energy-reversible complementary NEM logic gates 2008
- Characterization of magnetic nanoparticle-embedded SU8 for microactuation 2008
- Measuring charge and charge-decay in floating electrode electrostatic MEMS actuators 2008
- Nanowire coupled micro-resonators 2008
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Characterization of boron-doped micro- and nanocrystalline diamond films deposited by wafer-scale hot filament chemical vapor deposition for MEMS applications
DIAMOND AND RELATED MATERIALS
2008; 17 (1): 23-28
View details for DOI 10.1016/j.diamond.2007.09.010
View details for Web of Science ID 000252545600004
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Analytical modeling of the suspended-gate FET and design insights for low-power logic
IEEE TRANSACTIONS ON ELECTRON DEVICES
2008; 55 (1): 48-59
View details for DOI 10.1109/TED.2007.911070
View details for Web of Science ID 000252059000005
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Interface Quality Control of Monolithic Photonic Crystals by Hydrogen Annealing
2008 CONFERENCE ON LASERS AND ELECTRO-OPTICS & QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE, VOLS 1-9
2008: 316-317
View details for Web of Science ID 000260498400159
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The Dependence of Poly-crystalline SiC Mid-Infrared Optical Properties on Deposition Conditions
2008 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
2008: 182-183
View details for Web of Science ID 000264556700092
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Electrical, mechanical and metal contact properties of polycrystalline 3C-SiC films for MEMS in harsh environments
ELSEVIER SCIENCE SA. 2007: 8893-8898
View details for DOI 10.1016/j.sufcoat.2007.05.007
View details for Web of Science ID 000249340400019
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Nickel and platinum ohmic contacts to polycrystalline 3C-silicon carbide
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
2007; 139 (2-3): 235-239
View details for DOI 10.1016/j.mseb.2007.03.006
View details for Web of Science ID 000247182000021
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Mode shape imaging of out-of-plane and in-plane vibrating RF micromechanical resonators by atomic force microscopy
ELSEVIER SCIENCE BV. 2007: 1354-1357
View details for DOI 10.1016/j.mee.2007.01.223
View details for Web of Science ID 000247182500155
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Design considerations for complementary nanoelectromechanical logic gates
2007 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, VOLS 1 AND 2
2007: 299-302
View details for Web of Science ID 000259347800066
- Suspended mechanical structures based on elastic silicon nanowire arrays Nano Letters 2007; 7: 1100-1104
- Aqueous transduction of poly-SiGe disk resonators 2007
- Characterization of polycrystalline silicon-germanium film deposition for modularly integrated MEMS applications IEEE/ASME J. Microelectromechanical Systems 2007; 16: 68-77
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Effect of a vertical stack of aligned subwavelength metal hole arrays on extraordinary transmission spectra
2007 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
2007: 117-118
View details for Web of Science ID 000251224200059
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Phonon polariton reflectance spectra in a silicon carbide membrane hole array
2007 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2
2007: 466-467
View details for Web of Science ID 000259345200232
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Extraordinary transmission through a poly-SiC membrane with subwavelength hole arrays
2007 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS AND NANOPHOTONICS
2007: 157-158
View details for Web of Science ID 000251224200077
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Stress control of polycrystalline 3C-SiC films in a large-scale LPCVD reactor using 1,3-disilabutane and dichlorosilane as precursors
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2006; 16 (12): 2736-2739
View details for DOI 10.1088/0960-1317/16/12/029
View details for Web of Science ID 000242475200029
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Control of strain gradient in doped polycrystalline silicon carbide films through tailored doping
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2006; 16 (10): L1-L5
View details for DOI 10.1088/0960-1317/16/10/L01
View details for Web of Science ID 000242169400001
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Modal coupling in micromechanical vibratory rate gyroscopes
IEEE SENSORS JOURNAL
2006; 6 (5): 1144-1152
View details for DOI 10.1109/JSEN.2006.881432
View details for Web of Science ID 000240698200015
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Polycrystalline silicon carbide as a substrate material for reducing adhesion in MEMS
TRIBOLOGY LETTERS
2006; 21 (3): 226-232
View details for DOI 10.1007/s11249-006-9024-9
View details for Web of Science ID 000238140800006
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Single-source chemical vapor deposition of SiC films in a large-scale low-pressure CVD growth, chemical, and mechanical characterization reactor
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
2006; 153 (8): C562-C566
View details for DOI 10.1149/1.2208911
View details for Web of Science ID 000238470100043
- Back-end-of-line poly-SiGe disk resonators 2006
- Electrical characterization of n-type polycrystalline 3C-silicon carbide thin films deposited by 1,3-disilabutane J. Electrochem. Soc. 2006; 153: G548-G551
- Reconstituted wafer technology for heterogeneous integration 2006
- Microfluidic generation of tunable monodisperse double emulsions for templated silica particles 2006
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A new nano-electro-mechanical field effect transistor (NEMFET) design for low-power electronics
IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2005, TECHNICAL DIGEST
2005: 477-480
View details for Web of Science ID 000236225100108
- Microfluidic generation of tunable emulsions for templated monodisperse silica 2005
- Anchor loss simulation in resonators 2005
- Silicon nitride-on-silicon bar resonator using internal electrostatic transduction 2005
- Selective growth of Si nanowire arrays via galvanic displacement processes in water-in-oil microemulsions Journal of the Americal Chemical Society 2005; 127: 4574-4575
- Mechanical elasticity of single and double clamped silicon nanobeams fabricated by the vapor-liquid-solid method Applied Physics Letters 2005; 87: 53111-13
- Fully differential poly-SiC Lamé-mode resonator and checkerboard filter 2005
- Redundant MEMS resonators for precise reference oscillators 2005
- Simulation tools for damping in high frequency resonators 2005
- Thermal budget limits of quarter-micrometer foundry CMOS for post-processing MEMS devices IEEE Trans. Electron Devices 2005; 52: 2081-2086
- Pulsed Laser Annealing, a Low Thermal Budget Technique for Eliminating Stress Gradient in Poly-SiGe MEMS Structures IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 669-675
- Stress Stability of Poly-SiGe and Various Oxide Films in Humid Environments 2004
- Fatigue of Polycrystalline Silicon for Microelectromechanical Systems: Crack Growth and Stability under Resonant Loading Conditions Mechanics of Materials 2004; 36: 13-33
- Transformer coupled plasma etching of 3C-SiC films using fluorinated chemistry for MEMS applications J. Vac. Sci. Tech. B 2004; 22: 513-518
- Fracture of polycrystalline 3C-SiC films in microelectromechanical systems IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 972-976
- Effects of boron concentration on Si1-xGex properties for integrated MEMS technology 2004
- Internal electrostatic transduction for bulk-mode MEMS resonators 2004
- Effect of eximer laser annealing on the structural propoerties of silicon germanium films J. Materials Research 2004; 19: 3503-3511
- Single-source chemical vapor deposition of 3C-SiC films in a LPCVD reactor, part I: Growth, Structure, and Chemical Characterization Journal of the Electrochemical Society 2004; 151: 210-214
- High performance inductors using capillary based fluidic self-assembly IEEE/ASME J. of Microelectromechanical Systems 2004; 13: 300-309
- Poly-SiGe high frequency resonators based on lithographic definition of nano-gap lateral transducers 2004
- Hydrogen peroxide etching and stability of p-type poly-SiGe films 2004
- In-situ doped poly-SiGe LPCVD process using BCl3 for post-CMOS integration of MEMS devices 2004
- Ge-blade damascene process for post-CMOS integration of nano-mechanical resonators IEEE Electron Device Lett. 2004; 25: 529-531
- Coupling of resonant modes in micromechanical vibratory rate gyroscopes 2004
- Silicon carbide for enhanced MEMS reliability 2004
- Microbioreactor arrays with parametric control for high-throughput experimentation Biotechnology and Bioengineering 2004; 85: 376-381
- Recent progress toward a manufacturable polycrystalline SiC surface micromachining technology IEEE Sensors Journal 2004; 4: 441-448
- Electrostatic charge and field sensors based on micromechanical resonators IEEE/ASME J. of Microelectromechanical Systems 2003; 12: 577-589
- A modular process for integrating thick polysilicon MEMS devices with sub-micron CMOS 2003
- High modulus polycrystalline 3C-SiC technology for RF MEMS 2003
- Properties of phosphorus-doped poly-SiGe films for MEMS applications Journal of the Electrochemical Society 2003; 150: H1-H6
- Model for micropart planarization in capillary-based microassembly 2003
- Integrated Z-axis frame microgyroscope with ISOD design 2003
- The radial bulk annular resonator: towards a 50W RF MEMS filter 2003
- Optimization of poly-SiGe deposition processes for modular MEMS integration 2003
- Polycrystalline silicon germanium films for integrated microsystems IEEE/ASME Journal of Micro-electromechanical Systems 2003; 12: 160-171
- Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS applications J. Microlith. 2003; 2: 259-264
- Nitrogen doping of polycrystalline 3C-SiC films using 1,3-disilabutane in a conventional LPCVD reactor J. Crystal Growth 2003; 259: 18-25
- An integrated, vertical drive, in-plane-sense microgyroscope 2003
- A microfabricated electrochemical oxygen generator for high-density cell culture arrays IEEE/ASME J. of Microelectromechanical Systems 2003; 12: 590-599
- High-selectivity etching of polycrystalline 3C-SiC films using HBr-based transformer coupled plasma Applied Physics Letters 2003; 82: 1742-1744
- Microsystems Research in Japan WTEC, Baltimore, Maryland 2002
- Fluidic self-assembly of micromirrors onto microactuators using capillary forces (invited) IEEE Journal on Selected Topics in Quantum Electronics 2002; 8: 4-11
- Capacitive Interface for a Vertically Driven X&Y-Axis Rate Gyroscope 2002
- Interconnect issues for integrated MEMS technologies 2002
- A low-temperature CVD process for silicon carbide MEMS Sensors and Actuators A 2002; 97-98: 410-415
- A vacuum packaged surface micromachined resonant accelerometer IEEE/ASME Journal of Microelectromechanical Systems 2002; 11: 784-793
- Nitrogen doping of 3C-SiC films grown by single-source chemical vapor deposition Thin Solid Films 2002; 419: 69-75
- High-resolution electrometer with micromechanical variable capacitor 2002
- Recent progress in modularly integrated MEMS technologies 2002
- Low-temperature LPCVD MEMS technologies 2002
- Pulsed laser annealing of silicon germanium films 2002
- A microfabricated electrochemical oxygen generator for high-density cell culture arrays 2002
- Poly-SiGe: a high-Q structural material for integrated RF MEMS 2002
- Integrated surface-micromachined Z-axis frame microgyroscope 2002
- MEMS: Some Self-Assembly Required Optics & Photonics News 2002: 26-30
- Micromechanical Pierce oscillator for resonator sensor applications 2002
- An integrated microelectromechanical resonant-output gyroscope 2002
- Integrated MEMS technologies (invited) MRS Bulletin 2001
- High-aspect-ratio, molded microstructures with electrical isolation and embedded interconnects Microsystem Technologies 2001; 7: 47-54
- Modeling of capillary forces and binding sites for fluidic self-assembly 2001
- Full three-dimensional motion characterization of a gimballed electrostatic microactuator 2001
- Microstructure to substrate self-assembly using capillary forces IEEE/ASME J. of Microelectromechanical Systems 2001; 10: 17-24
- Microgimbal torsion beam design using open, thin-walled cross sections IEEE/ASME J. of Microelectromechanical Systems 2001; 10: 550-560
- Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS Sensors and Actuators A 2001; 91: 239-248
- Micromirrors for adaptive optics 2001
- Single-step assembly of complex 3-D microstructures 2000
- Alkene based monolayer films as anti-stiction coatings for polysilicon MEMS 2000
- Electrical isolation process for molded, high-aspect-ratio polysilicon microstructures 2000
- Silicon microbial bioreactor arrays 2000
- Post-CMOS modular integration of poly-SiGe microstructures using poly-Ge sacrificial layers 2000
- Stroboscropic interferometer with variable magnification to measure dynamics in an adaptive-optics micromirror 2000
- Fluidic self-assembly of micromirrors onto surface micromachined actuators 2000
- High aspect ratio poly-silicon-germanium microstructures 1999
- Batch transfer assembly of micro-components onto surface and SOI MEMS 1999
- Integrated resonant accelerometer based on rigidity change 1999
- An integrated CMOS micromechanical resonator high-Q oscillator IEEE J. Solid-State Circuits 1999; 34: 440-455
- Batch micropackaging by compression-bonded wafer-wafer transfer 1999
- Vacuum encapsulation of resonant devices using permeable polysilicon 1999
- Modeling and simulation of micromachined gyroscopes in the presence of imperfections 1999
- Fluidic microassembly using patterned self-assembled monolayers and shape matching 1999
- Optimization of poly-silicon-germanium as a microstructural material 1999
- Third harmonic double-ended tuning fork resonator 1999
- Materials characterization for MEMS - a comparison of uniaxial and bending tests 1999
- Performance evaluation of batch-transferred surface micromachined resonators 1999
- Statistical characterization of fracture of brittle MEMS materials 1999
- Post-CMOS integration of germanium microstructures 1999
- Dynamics and control of micromachined gyroscopes 1999
- Mechanical performance of an integrated microgimbal / microactuators for disk drives 1999
- Carbonized parylene as a conformal sacrificial layer for high aspect ratio molded polysilicon 1998
- Microassembly technologies for MEMS 1998
- Parallel microassembly with electrostatic force fields 1998
- Lubrication of polysilicon micromechanisms with self-assembled monolayers 1998
- Surface-micromachined 1 MHz oscillator with low-noise Pierce configuration 1998
- Commercialization of precision inertial sensors with integrated signal conditioning Sensors Expo West, San Jose, California 1998
- Fracture strength of polycrystalline silicon 1998
- Alkyltrichlorosilane-based self-assembled monolayer films for stiction reduction IEEE/ASME J. of Micro-electromechanical Systems 1998; 7: 252-260
- Surface micromachining for micro-electro-mechanical systems Proc. of the IEEE 1998; 86: 1552-1574
- Microelectromechanical filters for signal processing IEEE/ASME J. of Microelectromechanical Systems 1998; 7: 286-294
- Stiction reduction processes for surface micromachines Tribology Letters 1997; 3: 215-221
- Nonlinear mixing in surface-micromachined tuning fork oscillators 1997
- Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces J. of Applied Physics 1997; 81: 3474-3483
- Batch transfer of microstructures using flip-chip solder bump bonding 1997
- Hexsil tweezers for teleoperated micro-assembly 1997
- Self-assembled fluorocarbon films for enhanced stiction reduction 1997
- Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments 1997
- Experiments in micromanipulation and CAD-driven microassembly 1997
- A micro strain gauge with mechanical amplifier IEEE/ASME J. of Microelectromechanical Systems 1997; 6: 313-321
- Microelectronics: an Integrated Approach Prentice Hall. 1997
- Surface-micromachined resonant accelerometer 1997
- Critical review: stiction in surface micromechanical structures J. Vacuum Science and Technology B 1997; B15: 1-19
- Surface micromachined accelerometers IEEE J. of Solid-State Circuits 1996; 31: 366-375
- Self-assembled monolayers as permanent anti-stiction coatings for polysilicon microstructures 1996
- Wafer-to-wafer microstructure transfer for vacuum packaging 1996
- Z-axis vibratory rate gyroscope 1996
- Design, fabrication, position sensing, and control of an electrostatically driven polysilicon microactuator IEEE Trans. on Magnetics 1996; 32: 122-128
- Multi-mode digital control of suspended polysilicon microstructures IEEE/ASME J. of Microelectromechanical Systems 1996; 5: 283-297
- Polysilicon integrated microsystems: technologies and applications (invited) Sensors and Actuators A 1996; 56: 167-177
- Micromechanical structures for fracture testing of brittle thin films 1996
- Hexsil tweezers with polysilicon piezoresistive strain gauges Late News Digest, 7th Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C. 1996: 31-32
- Surface micromachined Z-axis vibratory rate gyroscope 1996
- Surface micromachined angular accelerometer with force feedback 1995
- Permeable Polysilicon Microshell Etch-Access Windows 1995
- Self-assembly of microsystems using non-contact electrostatic traps 1995
- High aspect ratio molded CVD silicon MEMS 1995
- Diamond-like carbon for silicon passivation in micromechanical devices 1995
- In Situ Phosphorus Doped Polysilicon for Integrated MEMS 1995
- Ammonium Fluoride Surface Treatments for Reducing In-Use Stiction in Polysilicon Microstructures 1995
- Polysilicon Integrated Microsystems: Technologies and Applications 1995
- Surface micromachined resonant force sensors 1995
- Surface Micromachining: from Vision to Reality to Vision edited by Drory, M., D., Bogy, D., B., Donley, M., S. 1995
- Recent Advances in Surface Micromachining 1995
- Hexsil bimorphs for vertical actuation 1995
- An integrated force-balanced capacitive accelerometer for low-G applications 1995
- Surface Micromachined Accelerometers 1995
- Nickel-filled thermally actuated hexsil tweezers 1995
- Young's Modulus of in-situ Phophorus-Doped Polysilicon 1995
- Silicon Micromachining for Resonator Fabrication 1994
- Silicon Surface Treatments for Stiction Reduction in Silicon Micromachining : A Surface Science Approach 1994
- Silicon dioxide sacrificial layer hydrofluoric acid etching: Part II -- modeling J. of the Electrochemical Society 1994; 141: 271-274
- Silicon dioxide sacrificial layer hydrofluoric acid etching: Part I - experimental observations J. of the Electrochemical Society 1994; 141: 264-269
- Integrated Testbed for Multi-Mode Digital Control of Suspended Microstructures 1994
- Design and Performance of CMOS Micromechanical Resonator Oscillators 1994
- Polysilicon Integrated Mechatronics: Applications and Recent Developments 1994
- Polysilicon microresonators for signal processing 1994
- Viscous damping model for laterally oscillating microstructures IEEE/ASME J. of Microelectromechanical Systems 1994; 3: 81-87
- Process Technology for the Modular Integration of CMOS and Microstructures (invited) Microsystem Technology 1994; 1: 30-41
- Micromechanical Resonators for Frequency References and Signal Processing 1994
- Slide film damping in laterally driven microstructures Sensors and Actuators A 1994; 40: 31-39
- Self-assembled monolayer film for enhanced imaging of rough surfaces with atomic force microscopy J. of Applied Physics 1994; 76: 5731-5737
- S-D Modulator interfacing with silicon microsensors Sensors 1993: 11-18
- Vacuum encapsulated lateral microresonators 1993
- Sigma-Delta modulator interfacing with microsensors Sensors Expo West, San Jose, California 1993: 159-164
- Determination of the etching kinetics for the hydrofluoric acid/silicon dioxide system J. of the Electrochemical Society 1993; 140: 2339-2346
- A novel micro in situ strain gauge 1993
- CMOS Micromechanical Resonator Oscillator 1993
- Polysilicon hollow beam lateral resonators 1993
- Stress-corrosion cracking and blistering of thin polycrystalline silicon films in hydrofluoric acid 1993
- A Chemical Reaction Mechanism and Kinetics for Hydrofluoric Acid Etching of Silicon Dioxide Thin Films (invited review) Thin Solid Films 1993; 232 (1): 1-12
- Supercritical carbon dioxide drying of microstructures 1993
- Highly compliant lateral suspensions using sidewall beams 1993
- Surface roughness modification of interfacial contacts in polysilicon microstructures 1993
- Microresonator frequency control using an integrated micro oven 1993
- Viscous energy dissipation in laterally oscillating planar microstructures: a theoretical and experimental study 1993
- Enhanced removal of sacrificial layers for silicon surface micromachining 1993
- Characterization of thin films using micromechanical structures 1992
- Stress and microstructure in phosphorus doped polycrystalline silicon 1992
- Electrostatic comb drive levitation and control method IEEE/ASME Journal of Microelectromechanical Systems 1992; 1 (4): 170-178
- Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry 1992
- Thermal microassembly of narrow-gap electrostatic comb-drive structures 1992
- Micro Electromechanical Filters 1992
- Silicon microfabricated accelerometers: a perspective on recent developments (invited paper), Sensors Expo, Chicago, Ill. 1992: 204A-1 - 204A-8.
- Recent developments in silicon microaccelerometers Sensors 1992: 31-41
- The effect of release-etch processing on surface microstructure stiction 1992
- Quality factor control for micromechanical resonators 1992
- Stress and microstructure in LPCVD polysilicon films: experimental results and closed form modeling of stresses 1992
- Sacrificial layer etching model for surface micromachining applications 1992
- Sacrificial layer Si02 wet etching for micromachining applications 1992
- Sacrificial Silicon Dioxide Wet Etching for Micromachining Applications 1991
- Stress in Undoped LPCVD Polycrystalline Silicon 1991
- Design and Modeling of a Linear Microactuator 1991
- Ultrasonically Induced Microtransport 1991
- Modeling and Position-Detection of a Polysilicon Linear Microactuator 1991
- Ultrasonically Induced Microtransport with Cylindrical Geometry 1991
- LPCVD Polysilicon Thin Films: The Evolution of Structure, Texture, and Stress 1991
- Micromechanical Structures for Thin Film Characterization 1991
- Self-Adjusting Microstructures 1991
- Fluid Motion Produced by Ultrasonic Lamb waves 1990
- Resonant-Bridge Two-Axis Microaccelerometer Sensors and Actuators 1990; A21-A23: 342-345
- Electrostatically Balanced Comb Drive for Controlled Levitation 1990
- A Planar Air-Levitated Electrostatic Actuator System 1990
- Polysilicon Microstructures to Characterize Static Friction 1990
- Spiral Microstructures for the Measurement of Average Strain Gradients in Thin Films 1990
- missing title J. of Applied Physics 1990; 67: 572-574
- Fabrication Technologies for Integrated Microdynamic Systems (invited paper), Integrated Micro-Motion Systems Micromachining, Control and Applications edited by Harashima, F. Amsterdam: Elsevier Science Publishers. 1990: 297-312
- Silicon micromechanics: sensors and actuators on a chip IEEE Spectrum 1990: 29-35
- Electrostatic-Comb Drive of Lateral Polysilicon Resonators Sensors and Actuators A 1990; A21-A23: 328-331
- Ultrasonic Micromotors: Physics and Applications 1990
- Investigation of texture and stress in undoped polysilicon films edited by Kamins, T., Thompson, C., V., Raicu, B. 1990
- Fracture-Toughness Characterization of Brittle Thin Films Sensors and Actuators 1990; A21-A23: 872-874
- Microsensors for heat transfer and fluid flow measurements Experimental Thermal and Fluid Science 1990; 3: 52-59
- Technologies for microdynamic devices Nanotechnology 1990; 1: 8-12
- Lamb-Wave Interactions with the Chemical, Biological and Physical Environment 1990
- Texture of Undoped LPCVD Polycrystalline Silicon Films 1989
- Microstructures for Fracture Toughness Characterization of Brittle Thin Films 1989
- Laterally Driven Polysilicon Resonant Microstructures 1989
- Ultrasonic micromotor 1989
- Electrostatic-Comb Drive of Lateral Polysilicon Resonators 1989
- Fracture-Toughness Characterization of Brittle Thin Films 1989
- Resonant-Bridge Two-Axis Microaccelerometer 1989
- Vacuum-insulated field-effect transistor Electronics Letters 1989; 25: 1571-1573
- Microsensor and microactuator applications of thin films Thin Solid Films 1989; 181: 235-243
- One-Port Active Polysilicon Resonant Microstructures 1989
- Microsensor and Microactuator Applications of Thin Films 1989
- Laterally driven polysilicon resonant microstructures Sensors and Actuators 1989; 20: 25-32
- Silicon Microdynamic Systems: Recent Developments in Microactuators and Micromachinery (invited paper), IEEE WESCON, San Francisco, California 1989: 202-204
- Process integration for active polysilicon resonant microstructures Sensors and Actuators 1989; 20: 143-151
- A digital readout technique for capacitive sensor applications IEEE J. of Solid-State Circuits 1988; 23: 972-977
- Surface Micromachining Processes for Electrostatic Motor Fabrication 1988
- Surface Micromachining for Microsensors and Microactuators 1988
- Design considerations for microfabricated electric actuators Sensors and Actuators 1988; 14: 269-292
- A Thermally Isolated Microstructure Suitable for Gas Sensing Applications 1988
- Microsensors for heat transfer and fluid flow measurements 1988
- Design and calibration of a microfabricated floating-element shear-stress sensor IEEE Trans. on Electron Devices 1988; 35: 750-757
- Surface micromachining for microsensors and microactuators J. of Vacuum Science and Technology, Part B 1988; 6: 1809-1813
- Microfabricated structures for the in-situ measurement of residual stress, Young’s modulus, and ultimate strain in polyimide films Applied Physics Letters 1987; 51: 241-243
- Silicon resonant microsensors 1987
- Resonant microsensors 1987
- Surface micromachining of polyimide/metal composites for a shear-stress sensor 1987
- Novel microstructures for the in-situ measurement of mechanical properties of thin films J. of Applied Physics 1987; 62: 3579-3584
- Fabrication and testing of a micromachined shear sensor 1987
- A micromachined floating-element shear sensor 1987
- Applications of polysilicon films in microsensors and microactuators 1987
- Electric micromotors: electromechanical characteristics 1987
- Polycrystalline silicon micromachining: a new technology for integrated sensors Annals of Biomedical Engineering 1986; 14: 187-197
- Resonant-microbridge vapor sensor IEEE Trans. on Electron Devices 1986; ED-33: 499-506
- Resonant structures for integrated sensors 1986
- Polycrystalline silicon microstructures (invited), Micromachining and Micropackaging of Transducers edited by Fung, C., F., Cheung, P., W., Ko, W., H. Amsterdam: Elsevier Science Publishers. 1985: 169-187
- Polysilicon bridges for anemometer applications 1985
- Frequency response of polycrystalline silicon microbridges edited by Fung, C., F., Cheung, P., W., Ko, W., H. 1985
- Resonant polysilicon microbridge with integrated NMOS detection circuitry 1984
- Integrated resonant-microbridge vapor sensor 1984
- Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties Sensors and Actuators 1983; 4: 447-454
- Polycrystalline silicon micromechanical beams J. of the Electrochemical Society 1983; 130: 1420-1423
- Polycrystalline Silicon Micromechanical Beams 1982