printer friendly pageMATSCI 198: Mechanical Properties of Materials (MATSCI 208)
Introduction to the mechanical behavior of solids, emphasizing the relationships between microstructure and mechanical properties. Elastic, anelastic, and plastic properties of materials. The relations between stress, strain, strain rate, and temperature for plastically deformable solids. Application of dislocation theory to strengthening mechanisms in crystalline solids. The phenomena of creep, fracture, and fatigue and their controlling mechanisms. Prerequisites: 193/203. Undergraduates register for 198 for 4 units; graduates register for 208 for 3 units.
Terms: Spr
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Units: 3-4
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UG Reqs: GER:DB-EngrAppSci
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Grading: Letter or Credit/No Credit
Instructors:
Dauskardt, R. (PI)
MATSCI 208: Mechanical Properties of Materials (MATSCI 198)
Introduction to the mechanical behavior of solids, emphasizing the relationships between microstructure and mechanical properties. Elastic, anelastic, and plastic properties of materials. The relations between stress, strain, strain rate, and temperature for plastically deformable solids. Application of dislocation theory to strengthening mechanisms in crystalline solids. The phenomena of creep, fracture, and fatigue and their controlling mechanisms. Prerequisites: 193/203. Undergraduates register for 198 for 4 units; graduates register for 208 for 3 units.
Terms: Spr
|
Units: 3-4
|
Grading: Letter or Credit/No Credit
Instructors:
Dauskardt, R. (PI)
MATSCI 353: Mechanical Properties of Thin Films
The mechanical properties of thin films on substrates. The mechanics of thin films and of the atomic processes which cause stresses to develop during thin film growth. Experimental techniques for studying stresses in and mechanical properties of thin films. Elastic, plastic, and diffusional deformation of thin films on substrates as a function of temperature and microstructure. Effects of deformation and fracture on the processing of thin film materials. Prerequisite: 198/208.
Terms: not given this year
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Units: 3
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Grading: Letter or Credit/No Credit
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