Kenneth Goodson
Davies Family Provostial Professor
Mechanical Engineering
Bio
Ken Goodson chairs the Mechanical Engineering Department and holds the Davies Family Provostial Professorship. He is a heat transfer specialist with interests ranging from electronics cooling to waste heat harvesting. His lab pioneered phonon free path measurements using silicon nanolayers and has highly-cited papers on conduction physics, novel thermal materials, and microfluidic heat sinks. Goodson's 40 PhD alumni include 17 professors at UC Berkeley, MIT, Stanford, and other schools. Goodson is a Fellow with ASME, IEEE, APS, and AAAS. Recognition includes the Kraus Medal and the Heat Transfer Memorial Award from ASME, the AIChE Kern Award, the IEEE THERMI Award, the SRC Technical Excellence Award, and, in 2015, named lectureships at MIT, Purdue, and the University of Illinois Urbana-Champaign. Goodson co-founded Cooligy, which developed heat sinks for the Apple G5.
Goodson performs as a baritone oratorio soloist in the San Francisco Bay Area, most frequently with the Stanford Symphonic Chorus and the San Francisco Choral Society. Goodson's music education included summer fellowships at Tanglewood and a music bachelors with the Sudler Prize and Phi Beta Kappa at MIT. Goodson's wife, Laura Dahl, is a member of the Stanford piano faculty.
Academic Appointments
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Professor, Mechanical Engineering
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Member, Bio-X
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Affiliate, Precourt Institute for Energy
Administrative Appointments
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Admissions Chair, Mechanical Engineering (2005 - 2006)
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Graduate Chair, Mechanical Engineering (2007 - 2008)
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Vice Chair, Mechanical Engineering (2008 - 2013)
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Robert Bosch Department Chair, Mechanical Engineering (2013 - Present)
Honors & Awards
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Aisinjioro-Soo Distinguished Lectureship, University of Illinois Urbana-Champaign (2015)
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Donald Q. Kern Heat Transfer Award, AIChE (2015)
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Hawkins Memorial Lectureship, Purdue University (2015)
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Rohsenow Lectureship, MIT (2015)
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Fellow, ASME, IEEE, APS, AAAS (2014)
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Heat Transfer Memorial Award for Science, ASME (2014)
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Technical Excellence Award, Semiconductor Research Corporation (2014)
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THERMI Award, IEEE (2013)
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Best/Outstanding Paper, ITHERM, SemiTherm, IEDM (2012, 2001, 1992)
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Golden/Outstanding Reviewer, IEEE, ASME (2010, 1999)
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Dusinberre Lectureship, Penn State University (2010)
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Kraus Thermal Management Medal, ASME (2010)
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Plenary Lectures, ITHERM, PHONONS, InterPack, Therminic, SemiTherm (2006-2013)
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CAREER Award, National Science Foundation (1996)
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JSPS Visiting Professorship, Tokyo Institute of Technology (1996)
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Young Investigator Award, Office of Naval Research (1996)
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Fellow in Voice, Tanglewood Music Festival (1990, 1991)
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Graduate Fellowship, Office of Naval Research (1989-1992)
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Luis Sudler Prize, MIT (1989)
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Tau Beta Pi, Phi Beta Kappa, Burchard Scholar, MIT (1988, 1989)
Boards, Advisory Committees, Professional Organizations
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ASME (Fellow), IEEE (Fellow), APS (Fellow), AAAS (Fellow) (2010 - Present)
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Chief Editor, Nanoscale & Microscale Thermophysical Engineering (2007 - 2012)
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Associate Editor, Journal of Heat Transfer (2008 - 2012)
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Member, Tau Beta Pi, Phi Beta Kappa, Sigma Xi (1989 - Present)
Professional Education
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PhD, MIT, Mechanical Engineering (1993)
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MS, MIT, Mechanical Engineering (1991)
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BS, MIT, Humanities (Music) (1989)
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BS, MIT, Mechanical Engineering (1989)
Patents
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34 ISSUED US PATENTS. "."
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Hu, Jiang, Goodson. " Patent 7,504,453 Composite Thermal Interface Material Including Particles and Nanofibers", Jan 1, 2009
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Goodson, Kenny, Santiago, et al. " Patent 6,942,018 Electroosmotic Microchannel Cooling System", Jan 1, 2005
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Zachai, Gutheit, Goodson. " Patent 5,843,224 Composite Structure comprising a Semiconductor Layer arranged on a Diamond...", Jan 1, 1998
Current Research and Scholarly Interests
We study heat transfer in electronic nanostructures & packaging, microfluidic heat sinks, and thermoelectric & photonic energy conversion devices. Our focus is on fundamental transport phenomena including heat conduction physics and two phase convection. We interact extensively with semiconductor and energy companies.
Current projects include thermoelectric waste heat recovery for vehicles, self-powered sensor networks, and smart buildings. We also study electron and phonon conduction and energy conversion mechanisms in nanostructures including nanolayers and composites. We develop advanced thermal management strategies for the latest computers, tablets, and smart phones. Finally, we have several research initiatives that take high performance heat exchangers to their limits (beyond 50kW/cm2!) through novel phase separation strategies and 3D fluid routing.
Projects
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Phonon Scattering and Confinement in Nanostructures (NSF)
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Phase Separation Microfluidic Cooling (DARPA, IBM)
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Thermoelectric Waste Heat Recovery for Vehicles (NSF, DOE, Bosch)
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Nanostructured Smart Phone Materials (SRC, Intel)
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Electron & Phonon Transport at Interfaces (AFOSR, Raytheon)
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Heat Exchangers Technologies for Steam Power Conversion (EPRI)
Location
Stanford CA
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Microfluidic Cooling for Satellites beyond 30kW/cm2 (Boeing)
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Thermoelectric Powered Smart Sensors (Analog Devices)
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Nanostructured Vapor Chambers for Vehicle Technologies (Toyota)
2015-16 Courses
- Fundamentals of Heat Conduction
ME 352B (Win) -
Independent Studies (12)
- Engineering Problems
ME 391 (Aut, Win, Spr, Sum) - Engineering Problems and Experimental Investigation
ME 191 (Aut, Win, Spr, Sum) - Experimental Investigation of Engineering Problems
ME 392 (Aut, Win, Spr, Sum) - Graduate Independent Study
MATSCI 399 (Aut, Win, Spr, Sum) - Honors Research
ME 191H (Aut, Win, Spr, Sum) - Master's Research
MATSCI 200 (Aut, Win, Spr, Sum) - Ph.D. Research
MATSCI 300 (Aut, Win, Spr, Sum) - Ph.D. Teaching Experience
ME 491 (Aut, Win, Spr, Sum) - Practical Training
MATSCI 299 (Aut, Win, Spr, Sum) - Practical Training
ME 299A (Aut, Win, Spr, Sum) - Practical Training
ME 299B (Aut, Win, Spr, Sum) - Undergraduate Research
MATSCI 150 (Aut)
- Engineering Problems
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Prior Year Courses
2014-15 Courses
- Fundamentals of Heat Conduction
ME 352B (Win)
2013-14 Courses
- Fundamentals of Heat Conduction
ME 352B (Win)
2012-13 Courses
- Fundamentals of Heat Conduction
ME 352B (Win) - Heat Transfer
ME 131A (Aut)
- Fundamentals of Heat Conduction
Stanford Advisees
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Postdoctoral Faculty Sponsor
Damena Agonafer, Jungwan Cho, Hyoung Soon Lee, Tanmoy Maitra, Seyed Mohammad Rezaei Niya -
Postdoctoral Research Mentor
Hyoung Soon Lee
All Publications
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Thermal characterization and analysis of microliter liquid volumes using the three-omega method.
Review of scientific instruments
2015; 86 (2): 024901-?
Abstract
Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.
View details for DOI 10.1063/1.4907353
View details for PubMedID 25725871
- Publication Overview: 180 Journal Articles, 275 Conference Papers, 32 Patents, 9 Book Chapters, 2 Books. 17000 Citations, H = 65 (Google Scholar). 8900 Citations, H = 47 (Web of Science) 2015
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Material and manufacturing cost considerations for thermoelectrics
RENEWABLE & SUSTAINABLE ENERGY REVIEWS
2014; 32: 313-327
View details for DOI 10.1016/j.rser.2013.12.030
View details for Web of Science ID 000333728700027
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Phonon Scattering in Strained Transition Layers for GaN Heteroepitaxy
Physical Review B
2014; 89: 11
View details for DOI 10.1103/PhysRevB.89.115301
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Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA
2013; 110 (51): 20426-20430
Abstract
Reliably routing heat to and from conversion materials is a daunting challenge for a variety of innovative energy technologies--from thermal solar to automotive waste heat recovery systems--whose efficiencies degrade due to massive thermomechanical stresses at interfaces. This problem may soon be addressed by adhesives based on vertically aligned carbon nanotubes, which promise the revolutionary combination of high through-plane thermal conductivity and vanishing in-plane mechanical stiffness. Here, we report the data for the in-plane modulus of aligned single-walled carbon nanotube films using a microfabricated resonator method. Molecular simulations and electron microscopy identify the nanoscale mechanisms responsible for this property. The zipping and unzipping of adjacent nanotubes and the degree of alignment and entanglement are shown to govern the spatially varying local modulus, thereby providing the route to engineered materials with outstanding combinations of mechanical and thermal properties.
View details for DOI 10.1073/pnas.1312253110
View details for Web of Science ID 000328548600031
View details for PubMedID 24309375
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Thermal conduction phenomena in carbon nanotubes and related nanostructured materials
REVIEWS OF MODERN PHYSICS
2013; 85 (3): 1295-1326
View details for DOI 10.1103/RevModPhys.85.1295
View details for Web of Science ID 000323334100001
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From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2013; 135 (6)
View details for DOI 10.1115/1.4023577
View details for Web of Science ID 000326165000012
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Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm
NANO LETTERS
2012; 12 (6): 3121-3126
Abstract
Thermal conduction in periodic multilayer composites can be strongly influenced by nonequilibrium electron-phonon scattering for periods shorter than the relevant free paths. Here we argue that two additional mechanisms-quasiballistic phonon transport normal to the metal film and inelastic electron-interface scattering-can also impact conduction in metal/dielectric multilayers with a period below 10 nm. Measurements use the 3? method with six different bridge widths down to 50 nm to extract the in- and cross-plane effective conductivities of Mo/Si (2.8 nm/4.1 nm) multilayers, yielding 15.4 and 1.2 W/mK, respectively. The cross-plane thermal resistance is lower than can be predicted considering volume and interface scattering but is consistent with a new model built around a film-normal length scale for phonon-electron energy conversion in the metal. We introduce a criterion for the transition from electron to phonon dominated heat conduction in metal films bounded by dielectrics.
View details for DOI 10.1021/nl300996r
View details for Web of Science ID 000305106400078
View details for PubMedID 22563928
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Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness
NANO LETTERS
2012; 12 (2): 683-686
Abstract
While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.
View details for DOI 10.1021/nl203548w
View details for Web of Science ID 000299967800026
View details for PubMedID 22224582
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Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
2011; 54 (25-26): 5504-5516
View details for DOI 10.1016/j.ijheatmasstransfer.2011.07.040
View details for Web of Science ID 000296035300037
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Adiabatic and diabatic two-phase venting flow in a microchannel
INTERNATIONAL JOURNAL OF MULTIPHASE FLOW
2011; 37 (9): 1135-1146
View details for DOI 10.1016/j.ijmultiphaseflow.2011.06.013
View details for Web of Science ID 000295242200013
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Impact of channel geometry on two-phase flow in fuel cell microchannels
JOURNAL OF POWER SOURCES
2011; 196 (11): 5012-5020
View details for DOI 10.1016/j.jpowsour.2011.02.032
View details for Web of Science ID 000289599900018
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Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density
ACS NANO
2011; 5 (6): 4818-4825
View details for DOI 10.1021/nn200847u
View details for Web of Science ID 000292055200065
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Phase Change Memory
PROCEEDINGS OF THE IEEE
2010; 98 (12): 2201-2227
View details for DOI 10.1109/JPROC.2010.2070050
View details for Web of Science ID 000284410800016
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Characterization of the wettability of thin nanostructured films in the presence of evaporation
JOURNAL OF COLLOID AND INTERFACE SCIENCE
2010; 349 (1): 354-360
Abstract
Vapor chambers using conventional porous membrane wicks offer limited heat transfer rates for a given thickness. This limitation can be addressed through wick nanostructuring, which promises high capillary pressures and precise control of the local porosity. This work develops a measurement technique for the wettability of nanostructured wicks based on optical imaging. Feasibility is demonstrated on a hydrophilic silicon nanowire array (SiNW) synthesized using the Vapor-Liquid-Solid (VLS) growth mechanism followed by surface plasma treatment. The wettability is determined by comparing the time-dependent liquid interface rise with a model that accounts for capillary, viscous, and gravitational forces and for evaporation. This model is demonstrated to be useful in extracting internal contact angle from thin ( approximately 10microm) porous films.
View details for DOI 10.1016/j.jcis.2010.05.063
View details for Web of Science ID 000279966700045
View details for PubMedID 20579656
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Nanofluid Convection in Microtubes
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2010; 132 (9)
View details for DOI 10.1115/1.4001637
View details for Web of Science ID 000279992300016
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Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films
PHYSICAL REVIEW B
2009; 80 (4)
View details for DOI 10.1103/PhysRevB.80.045314
View details for Web of Science ID 000268618100073
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Heat Conduction through a DNA-Gold Composite
NANO LETTERS
2009; 9 (5): 2005-2009
Abstract
This paper reports results from electrical and thermal conduction measurements carried out on the DNA-gold composite for which the overall conduction is shown to be dominated by the DNA rather than the discontinuous gold coatings. The electrical and thermal conductivities of the composite were about 14 S/cm and 150 W/(m K) at room temperature, respectively. The resulting value of 3.6 x 10(-4) W ohms/K(2) for the Lorentz number indicates that thermal transport in the DNA is phonon-dominated and that the molecular vibrations play a key role in both electrical and thermal conduction processes of DNA molecules.
View details for DOI 10.1021/nl900272m
View details for Web of Science ID 000266157100049
View details for PubMedID 19435380
- Ordering up the Minimum Thermal Conductivity of Solids SCIENCE 2007; 315: 342-343
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Heat generation and transport in nanometer-scale transistors
PROCEEDINGS OF THE IEEE
2006; 94 (8): 1587-1601
View details for DOI 10.1109/JPROC.2006.879794
View details for Web of Science ID 000240963400010
- Nanoscale Thermal Transport Applied Physics Reviews 2014; 1: 011305
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$ per W metrics for thermoelectric power generation: beyond ZT
ENERGY & ENVIRONMENTAL SCIENCE
2013; 6 (9): 2561-2571
View details for DOI 10.1039/c3ee41504j
View details for Web of Science ID 000323198100001
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High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
JOURNAL OF ELECTRONIC PACKAGING
2013; 135 (3)
View details for DOI 10.1115/1.4024747
View details for Web of Science ID 000326095800010
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Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2013; 3 (9): 1524-1532
View details for DOI 10.1109/TCPMT.2013.2254175
View details for Web of Science ID 000324384600010
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Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals
APPLIED PHYSICS LETTERS
2013; 102 (19)
View details for DOI 10.1063/1.4807141
View details for Web of Science ID 000320440800035
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Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance
APPLIED PHYSICS LETTERS
2013; 102 (11)
View details for DOI 10.1063/1.4796168
View details for Web of Science ID 000316544900032
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Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module
JOURNAL OF ELECTRONIC MATERIALS
2013; 42 (3): 372-381
View details for DOI 10.1007/s11664-012-2366-1
View details for Web of Science ID 000314529300004
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Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
2013; 3 (1): 79-85
View details for DOI 10.1109/TCPMT.2012.2223818
View details for Web of Science ID 000313687100010
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Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory
IEEE TRANSACTIONS ON ELECTRON DEVICES
2012; 59 (12): 3561-3567
View details for DOI 10.1109/TED.2012.2219311
View details for Web of Science ID 000311680400060
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Phonon Conduction in Periodically Porous Silicon Nanobridges
NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING
2012; 16 (4): 199-219
View details for DOI 10.1080/15567265.2012.732195
View details for Web of Science ID 000311949300001
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Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics
JOURNAL OF APPLIED PHYSICS
2012; 112 (8)
View details for DOI 10.1063/1.4759450
View details for Web of Science ID 000310597500020
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Thermal conductivity in porous silicon nanowire arrays
NANOSCALE RESEARCH LETTERS
2012; 7
Abstract
The nanoscale features in silicon nanowires (SiNWs) can suppress phonon propagation and strongly reduce their thermal conductivities compared to the bulk value. This work measures the thermal conductivity along the axial direction of SiNW arrays with varying nanowire diameters, doping concentrations, surface roughness, and internal porosities using nanosecond transient thermoreflectance. For SiNWs with diameters larger than the phonon mean free path, porosity substantially reduces the thermal conductivity, yielding thermal conductivities as low as 1 W/m/K in highly porous SiNWs. However, when the SiNW diameter is below the phonon mean free path, both the internal porosity and the diameter significantly contribute to phonon scattering and lead to reduced thermal conductivity of the SiNWs.
View details for DOI 10.1186/1556-276X-7-554
View details for Web of Science ID 000311320400001
View details for PubMedID 23039084
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Nanoscale Manipulation, Heating, and Welding of Nanowires
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2012; 134 (8)
View details for Web of Science ID 000306143200010
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Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films
CARBON
2012; 50 (10): 3789-3798
View details for DOI 10.1016/j.carbon.2012.04.004
View details for Web of Science ID 000305851700050
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Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness
JOURNAL OF APPLIED PHYSICS
2012; 112 (1)
View details for DOI 10.1063/1.4731252
View details for Web of Science ID 000306513400151
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Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling
NANOTECHNOLOGY
2012; 23 (20)
Abstract
The coupled transport of heat and electrical current, or thermoelectric phenomena, can strongly influence the temperature distribution and figures of merit for phase-change memory (PCM). This paper simulates PCM devices with careful attention to thermoelectric transport and the resulting impact on programming current during the reset operation. The electrothermal simulations consider Thomson heating within the phase-change material and Peltier heating at the electrode interface. Using representative values for the Thomson and Seebeck coefficients extracted from our past measurements of these properties, we predict a cell temperature increase of 44% and a decrease in the programming current of 16%. Scaling arguments indicate that the impact of thermoelectric phenomena becomes greater with smaller dimensions due to enhanced thermal confinement. This work estimates the scaling of this reduction in programming current as electrode contact areas are reduced down to 10 nm × 10 nm. Precise understanding of thermoelectric phenomena and their impact on device performance is a critical part of PCM design strategies.
View details for DOI 10.1088/0957-4484/23/20/205201
View details for Web of Science ID 000303531400004
View details for PubMedID 22543873
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Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness
APPLIED PHYSICS LETTERS
2012; 100 (16)
View details for DOI 10.1063/1.3699227
View details for Web of Science ID 000303128500018
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Electrothermal phenomena in zinc oxide nanowires and contacts
APPLIED PHYSICS LETTERS
2012; 100 (16)
View details for DOI 10.1063/1.4703935
View details for Web of Science ID 000303128500048
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Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology
IEEE ELECTRON DEVICE LETTERS
2012; 33 (3): 378-380
View details for DOI 10.1109/LED.2011.2181481
View details for Web of Science ID 000300580000026
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Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory
JAPANESE JOURNAL OF APPLIED PHYSICS
2012; 51 (2)
View details for DOI 10.1143/JJAP.51.02BD06
View details for Web of Science ID 000303481400028
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Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2012; 21 (1): 4-6
View details for DOI 10.1109/JMEMS.2011.2175704
View details for Web of Science ID 000300104600001
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Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators
CARBON
2012; 50 (2): 347-355
View details for DOI 10.1016/j.carbon.2011.08.009
View details for Web of Science ID 000297397700001
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Thermal conductivity and photoluminescence of light-emitting silicon nitride films
APPLIED PHYSICS LETTERS
2012; 100 (5)
View details for DOI 10.1063/1.3682508
View details for Web of Science ID 000300065300023
- Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness Journal of Applied Physics 2012; 112: 014902
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High temperature thermal properties of thin tantalum nitride films
APPLIED PHYSICS LETTERS
2011; 99 (26)
View details for DOI 10.1063/1.3672098
View details for Web of Science ID 000298638500022
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Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage
JOURNAL OF APPLIED PHYSICS
2011; 110 (11)
View details for DOI 10.1063/1.3667295
View details for Web of Science ID 000298254800159
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Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials
IEEE ELECTRON DEVICE LETTERS
2011; 32 (9): 1281-1283
View details for DOI 10.1109/LED.2011.2158796
View details for Web of Science ID 000294171600039
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Microthermal Stage for Electrothermal Characterization of Phase-Change Memory
IEEE ELECTRON DEVICE LETTERS
2011; 32 (7): 952-954
View details for DOI 10.1109/LED.2011.2144952
View details for Web of Science ID 000292165200040
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Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory
IEEE ELECTRON DEVICE LETTERS
2011; 32 (7): 961-963
View details for DOI 10.1109/LED.2011.2150193
View details for Web of Science ID 000292165200043
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Thermal microdevices for biological and biomedical applications
JOURNAL OF THERMAL BIOLOGY
2011; 36 (4): 209-218
View details for DOI 10.1016/j.jtherbio.2011.02.006
View details for Web of Science ID 000292174200001
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Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films
JOURNAL OF APPLIED PHYSICS
2011; 109 (8)
View details for DOI 10.1063/1.3573505
View details for Web of Science ID 000290047000229
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Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage
IEEE TRANSACTIONS ON ELECTRON DEVICES
2011; 58 (3): 584-592
View details for DOI 10.1109/TED.2010.2095502
View details for Web of Science ID 000287665700001
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3-D visualization of flow in microscale jet impingement systems
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
2011; 50 (3): 325-331
View details for DOI 10.1016/j.ijthermalsci.2010.08.005
View details for Web of Science ID 000287285700012
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Thermal resistance between low-dimensional nanostructures and semi-infinite media (vol 103, 094301, 2008)
JOURNAL OF APPLIED PHYSICS
2011; 109 (5)
View details for DOI 10.1063/1.3558984
View details for Web of Science ID 000288387900131
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Temperature-dependent aggregation and diffusion in nanofluids
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
2011; 54 (4): 797-806
View details for DOI 10.1016/j.ijheatmasstransfer.2010.06.058
View details for Web of Science ID 000287054800007
- Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory IEEE Electron Device Letters 2011; 32: 952-954
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Aggregate fractal dimensions and thermal conduction in nanofluids
JOURNAL OF APPLIED PHYSICS
2010; 108 (7)
View details for DOI 10.1063/1.3481423
View details for Web of Science ID 000283222200125
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Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation
INTERNATIONAL JOURNAL OF MULTIPHASE FLOW
2010; 36 (8): 608-619
View details for DOI 10.1016/j.ijmultiphaseflow.2010.04.005
View details for Web of Science ID 000279954300002
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Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films
NANO LETTERS
2010; 10 (7): 2395-2400
Abstract
Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the measured film heat capacity. The metal-SWNT and SWNT-substrate resistances range between 3.8 and 9.2 mm(2)K/W and 33-46 mm(2)K/W, respectively. The temperature dependency of the heat capacity data, measured between 125 and 300 K, is in good agreement with theoretical predictions. The temperature dependence demonstrated by the metal-SWNT interface resistance data suggests inelastic phonon transmission.
View details for DOI 10.1021/nl100443x
View details for Web of Science ID 000280416200017
View details for PubMedID 20503983
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Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
2010; 20 (4)
View details for DOI 10.1088/0960-1317/20/4/045018
View details for Web of Science ID 000275841800019
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Thermal Boundary Resistance Measurements for Phase-Change Memory Devices
IEEE ELECTRON DEVICE LETTERS
2010; 31 (1): 56-58
View details for DOI 10.1109/LED.2009.2035139
View details for Web of Science ID 000273090800020
- Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel Frontiers of Heat and Mass Transfer 2010; 1: 013002
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Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform
SENSORS AND ACTUATORS B-CHEMICAL
2009; 143 (1): 286-294
View details for DOI 10.1016/j.snb.2009.08.035
View details for Web of Science ID 000272376800043
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Bubble-Induced Water Hammer and Cavitation in Microchannel Flow Boiling
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2009; 131 (12)
View details for DOI 10.1115/1.3216381
View details for Web of Science ID 000271905600007
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Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films
IEEE ELECTRON DEVICE LETTERS
2009; 30 (12): 1269-1271
View details for DOI 10.1109/LED.2009.2032937
View details for Web of Science ID 000272044500007
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A benchmark study on the thermal conductivity of nanofluids
JOURNAL OF APPLIED PHYSICS
2009; 106 (9)
View details for DOI 10.1063/1.3245330
View details for Web of Science ID 000272555700090
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Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance
IEEE TRANSACTIONS ON ADVANCED PACKAGING
2009; 32 (2): 423-430
View details for DOI 10.1109/TADVP.2008.924221
View details for Web of Science ID 000266778000021
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Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2009; 131 (5)
View details for DOI 10.1115/1.3013831
View details for Web of Science ID 000264374400011
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Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling
EXPERIMENTS IN FLUIDS
2009; 46 (4): 725-736
View details for DOI 10.1007/s00348-008-0604-3
View details for Web of Science ID 000265081300013
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Multimode thermoelastic dissipation
JOURNAL OF APPLIED PHYSICS
2009; 105 (4)
View details for DOI 10.1063/1.3072682
View details for Web of Science ID 000263803300018
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FLOW REGIME EVOLUTION IN LONG, SERPENTINE MICROCHANNELS WITH A POROUS CARBON PAPER WALL
IMECE 2008: HEAT TRANSFER, FLUID FLOWS, AND THERMAL SYSTEMS, VOL 10, PTS A-C
2009: 773-781
View details for Web of Science ID 000265085300094
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THERMOELECTRIC HEAT RECOVERY FROM A TANKLESS WATER HEATING SYSTEM
IMECE 2008: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2008, VOL 8
2009: 131-137
View details for Web of Science ID 000265684200014
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Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films
NVMTS: 2009 10TH ANNUAL NON-VOLATILE MEMORY TECHNOLOGY SYMPOSIUM
2009: 52-57
View details for Web of Science ID 000278758600008
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Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3 omega method
INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW
2008; 29 (5): 1456-1461
View details for DOI 10.1016/j.ijheatfluidflow.2008.04.007
View details for Web of Science ID 000260645600021
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Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3 omega method
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2008; 130 (10)
View details for DOI 10.1115/1.2945904
View details for Web of Science ID 000259854000011
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The impact of thermal boundary resistance in phase-change memory devices
IEEE ELECTRON DEVICE LETTERS
2008; 29 (10): 1112-1114
View details for DOI 10.1109/LED.2008.2003012
View details for Web of Science ID 000259812900009
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Diffusion, aggregation, and the thermal conductivity of nanofluids
APPLIED PHYSICS LETTERS
2008; 93 (10)
View details for DOI 10.1063/1.2977868
View details for Web of Science ID 000259797000084
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Investigation of the natural convection boundary condition in microfabricated structures
INTERNATIONAL JOURNAL OF THERMAL SCIENCES
2008; 47 (7): 820-824
View details for DOI 10.1016/j.ijthermalsci.2007.07.011
View details for Web of Science ID 000256576500002
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3-D numerical simulation of contact angle hysteresis for microscale two phase flow
INTERNATIONAL JOURNAL OF MULTIPHASE FLOW
2008; 34 (7): 690-705
View details for DOI 10.1016/j.ijmultiphaseflow.2007.08.008
View details for Web of Science ID 000258250300008
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Thermal resistance between low-dimensional nanostructures and semi-infinite media
JOURNAL OF APPLIED PHYSICS
2008; 103 (9)
View details for DOI 10.1063/1.2903519
View details for Web of Science ID 000255983200119
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Thermal properties of metal-coated vertically aligned single-wall nanotube arrays
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2008; 130 (5)
View details for DOI 10.1115/1.2885159
View details for Web of Science ID 000255880300006
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Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs
IEEE TRANSACTIONS ON ELECTRON DEVICES
2008; 55 (1): 220-232
View details for DOI 10.1109/TED.2007.911043
View details for Web of Science ID 000252059000019
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Thermomechanical formation of nanoscale polymer indents with a heated silicon tip
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2007; 129 (11): 1600-1604
View details for DOI 10.1115/1.2764088
View details for Web of Science ID 000251725700015
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Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films
APPLIED PHYSICS LETTERS
2007; 91 (11)
View details for DOI 10.1063/1.2784169
View details for Web of Science ID 000249474000022
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Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates
JOURNAL OF APPLIED PHYSICS
2007; 101 (9)
View details for DOI 10.1063/1.2717855
View details for Web of Science ID 000246567900049
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Materials science. Ordering up the minimum thermal conductivity of solids.
Science
2007; 315 (5810): 342-343
View details for PubMedID 17234938
- Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays ASME Journal of Heat Transfer 2007; 129: 91-93
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Non-equilibrium phonon distributions in sub-100 nm silicon transistors
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2006; 128 (7): 638-647
View details for DOI 10.1115/1.2194041
View details for Web of Science ID 000239047600003
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A hybrid method for bubble geometry reconstruction in two-phase microchannels
EXPERIMENTS IN FLUIDS
2006; 40 (6): 847-858
View details for DOI 10.1007/s00348-006-0123-z
View details for Web of Science ID 000239549100003
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Two-phase microfluidics for semiconductor circuits and fuel cells
HEAT TRANSFER ENGINEERING
2006; 27 (4): 53-63
View details for DOI 10.1080/01457630500523816
View details for Web of Science ID 000236239500006
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Thermal conductance of an individual single-wall carbon nanotube above room temperature
NANO LETTERS
2006; 6 (1): 96-100
Abstract
The thermal properties of a suspended metallic single-wall carbon nanotube (SWNT) are extracted from its high-bias (I-V) electrical characteristics over the 300-800 K temperature range, achieved by Joule self-heating. The thermal conductance is approximately 2.4 nW/K, and the thermal conductivity is nearly 3500 Wm(-1)K(-1) at room temperature for a SWNT of length 2.6 mum and diameter 1.7 nm. A subtle decrease in thermal conductivity steeper than 1/T is observed at the upper end of the temperature range, which is attributed to second-order three-phonon scattering between two acoustic modes and one optical mode. We discuss sources of uncertainty and propose a simple analytical model for the SWNT thermal conductivity including length and temperature dependence.
View details for DOI 10.1021/nl052145f
View details for Web of Science ID 000235532400018
View details for PubMedID 16402794
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Electro-thermal transport in silicon and carbon nanotube devices
NONEQUILIBRIUM CARRIER DYNAMICS IN SEMICONDUCTORS PROCEEDINGS
2006; 110: 195-199
View details for Web of Science ID 000242486900044
- Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes Journal of Physical Chemistry B 2006; 110: 1502-1505
- 3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon ASME Journal of Heat Transfer 2006; 128: 1109-1113
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Scaling analysis of multilevel interconnect temperatures for high-performance ICs
IEEE TRANSACTIONS ON ELECTRON DEVICES
2005; 52 (12): 2710-2719
View details for DOI 10.1109/TED.2005.859612
View details for Web of Science ID 000233682200025
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Negative differential conductance and hot phonons in suspended nanotube molecular wires
PHYSICAL REVIEW LETTERS
2005; 95 (15)
Abstract
Freely suspended metallic single-walled carbon nanotubes (SWNTs) exhibit reduced current carrying ability compared to those lying on substrates, and striking negative differential conductance at low electric fields. Theoretical analysis reveals significant self-heating effects including electron scattering by hot nonequilibrium optical phonons. Electron transport characteristics under strong self-heating are exploited for the first time to probe the thermal conductivity of individual SWNTs (approximately 3600 W m-1 K-1 at T=300 K) up to approximately 700 K, and reveal a 1/T dependence expected for umklapp phonon scattering at high temperatures.
View details for DOI 10.1103/PhysRevLett.95.155505
View details for Web of Science ID 000232443400039
View details for PubMedID 16241738
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Phase change phenomena in silicon microchannels
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
2005; 48 (8): 1572-1582
View details for DOI 10.1016/j.ijheatmasstransfer.2004.09.048
View details for Web of Science ID 000228228400015
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Monte Carlo simulation of Joule heating in bulk and strained silicon
APPLIED PHYSICS LETTERS
2005; 86 (8)
View details for DOI 10.1063/1.1870106
View details for Web of Science ID 000227609000032
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Scattering of g-process longitudinal optical phonons at hotspots in silicon
JOURNAL OF APPLIED PHYSICS
2005; 97 (2)
View details for DOI 10.1063/1.1831549
View details for Web of Science ID 000226700500049
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Bond line thickness of thermal interface materials with carbon nanotubes
ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C
2005: 379-383
View details for Web of Science ID 000241978200048
- Thermal Conduction in Silicon Micro and Nanostructures Annual Review of Heat Transfer 2005; 14: 129-168
- Managing Heat for Electronics Materials Today 2005; 6: 30-35
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Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method
MICRO-ELECTRO-MECHANICAL SYSTEMS - 2005
2005; 7: 537-541
View details for Web of Science ID 000243038100084
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Review: Multiscale thermal modeling in nanoelectronics
INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING
2005; 3 (1): 107-133
View details for Web of Science ID 000235549800008
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Micromachined jets for liquid impingement cooling of VLSI chips (vol 13, pg 833, 2004)
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2004; 13 (6): 1072-1072
View details for DOI 10.1109/JMEMS.2004.840851
View details for Web of Science ID 000225515100022
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Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion
JOURNAL OF APPLIED PHYSICS
2004; 96 (9): 4998-5005
View details for DOI 10.1063/1.1788838
View details for Web of Science ID 000224799300042
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Micromachined jets for liquid impingement cooling of VLSI chips
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2004; 13 (5): 833-842
View details for DOI 10.1109/JMEMS.2004.835768
View details for Web of Science ID 000224413100014
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Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements
APPLIED PHYSICS LETTERS
2004; 85 (11): 2086-2088
View details for DOI 10.1063/1.1787160
View details for Web of Science ID 000223923300073
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Nucleation and growth of vapor bubbles in a heated silicon microchannel
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2004; 126 (4): 497-497
View details for Web of Science ID 000223989100004
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Convectively driven polymerase chain reaction thermal cycler
ANALYTICAL CHEMISTRY
2004; 76 (14): 4011-4016
Abstract
We have fabricated a low-cost disposable polymerase chain reaction thermal chamber that uses buoyancy forces to move the sample solution between the different temperatures necessary for amplification. Three-dimensional, unsteady finite element modeling and a simpler 1-D steady-state model are used together with digital particle image velocimetry data to characterize the flow within the device. Biological samples have been amplified using this novel thermal chamber. Time for amplification is less than 30 min. More importantly, an analysis of the energy consumption shows significant improvements over current technology.
View details for DOI 10.1021/ac034941g
View details for Web of Science ID 000222706400018
View details for PubMedID 15253636
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Thermal microscopy with a microfabricated solid immersion lens
MICROSCALE THERMOPHYSICAL ENGINEERING
2003; 7 (4): 267-273
View details for DOI 10.1080/10893950390245985
View details for Web of Science ID 000186732300001
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Special Issue on emerging technologies - Foreword
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
2003; 26 (2): 307-308
View details for DOI 10.1109/TCAPT.2003.816231
View details for Web of Science ID 000186046300001
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Nanoscale thermal transport
JOURNAL OF APPLIED PHYSICS
2003; 93 (2): 793-818
View details for DOI 10.1063/1.1524305
View details for Web of Science ID 000180134200001
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Detailed heat generation simulations via the Monte Carlo method
2003 IEEE INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES
2003: 121-124
View details for Web of Science ID 000185660800030
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Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) - 2003
2003: 251-257
View details for Web of Science ID 000222633100040
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Thermal conductivity model for nearly pure and doped thin silicon layers at high temperatures
ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003
2003: 847-853
View details for Web of Science ID 000222522400103
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Closed-loop cooling technologies for microprocessors
2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST
2003: 775-778
View details for Web of Science ID 000189158800177
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Thermal analysis of ultra-thin body device scaling
2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST
2003: 883-886
View details for Web of Science ID 000189158800202
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Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2002; 11 (6): 765-774
View details for DOI 10.1109/JMEMS.2002.803283
View details for Web of Science ID 000179740900017
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Thermal conduction in doped single-crystal silicon films
JOURNAL OF APPLIED PHYSICS
2002; 91 (8): 5079-5088
View details for DOI 10.1063/1.1458057
View details for Web of Science ID 000174666600047
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Thermometry and thermal transport in micro/nanoscale solid-state devices and structures
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2002; 124 (2): 223-241
View details for DOI 10.1115/1.1454111
View details for Web of Science ID 000175917200002
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Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2002; 11 (1): 12-19
View details for Web of Science ID 000173751000002
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Modeling resist heating in mask fabrication using a multilayer Green's function approach.
METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVI, PTS 1 & 2
2002; 4689: 206-212
View details for Web of Science ID 000178071700021
- Electroosmotic Microchannel Cooling System for Microprocessors Electronics Cooling 2002; 8: 46-47
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Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system
THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS
2002: 133-139
View details for Web of Science ID 000181956000016
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Microfabricated silicon solid immersion lens
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2001; 10 (3): 450-459
View details for Web of Science ID 000170875900015
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Thermal conductivity of doped polysilicon layers
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
2001; 10 (3): 360-369
View details for Web of Science ID 000170875900005
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Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC)
OPTICAL ENGINEERING
2001; 40 (8): 1613-1620
View details for Web of Science ID 000170933100029
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Thermal characterization of Bi2Te3/Sb2Te3 superlattices
JOURNAL OF APPLIED PHYSICS
2001; 90 (2): 763-767
View details for Web of Science ID 000169660000033
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Refraction contrast imaging with a scanning microlens
APPLIED PHYSICS LETTERS
2001; 78 (23): 3589-3591
View details for Web of Science ID 000168996900007
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Measurement of ballistic phonon conduction near hotspots in silicon
APPLIED PHYSICS LETTERS
2001; 78 (21): 3331-3333
View details for Web of Science ID 000168721200057
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A deterministic methodology for prediction of fracture distribution in basaltic multiflows
JOURNAL OF GEOPHYSICAL RESEARCH-SOLID EARTH
2001; 106 (B4): 6447-6459
View details for Web of Science ID 000167920500008
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Focusing in microlenses close to a wavelength in diameter
OPTICS LETTERS
2001; 26 (7): 399-401
Abstract
Light focused from air into a spherical microlens is affected by diffraction at the lens surface as its diameter approaches the wavelength of light. Through an extension of Mie theory, we show that a converging wave that is incident upon a Si microlens with a diameter less than approximately 4lambda creates a spot as much as 25% smaller than predicted with vector diffraction theory. Si microlenses only a wavelength in diameter are shown to be virtually insensitive to variations in the maximum illumination angle, and changes in index of refraction are not found to cause the proportional changes in spot size that would be expected from vector diffraction theory.
View details for Web of Science ID 000167774200001
View details for PubMedID 18040333
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Atomic force microscope cantilevers for combined thermomechanical data writing and reading
APPLIED PHYSICS LETTERS
2001; 78 (9): 1300-1302
View details for Web of Science ID 000167151000044
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Sub-continuum simulations of heat conduction in silicon-on-insulator transistors
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
2001; 123 (1): 130-137
View details for Web of Science ID 000167368600016
- Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers International Journal of Thermophysics 2001; 22: 605-616
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Near-field infrared imaging with a microfabricated solid immersion lens
APPLIED PHYSICS LETTERS
2000; 77 (14): 2109-2111
View details for Web of Science ID 000089524900010
- Millipede - An AFM Data Storage System at the Frontier of Nanotribology Tribology Letters 2000; 9: 25-32
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"Millipede" - an AFM data storage system at the frontier of nanotribology
TRIBOLOGY LETTERS
2000; 9 (1-2): 25-32
View details for Web of Science ID 000167678500004
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Impact of molecular orientation on thermal conduction in spin-coated polyimide films
JOURNAL OF APPLIED PHYSICS
1999; 86 (4): 1925-1931
View details for Web of Science ID 000081720600022
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Intrinsic-carrier thermal runaway in silicon microcantilevers
MICROSCALE THERMOPHYSICAL ENGINEERING
1999; 3 (3): 217-228
View details for Web of Science ID 000082536200006
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Measurement of the thermal conductivity anisotropy in polyimide films
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
1999; 8 (2): 180-191
View details for Web of Science ID 000080737300007
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Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition
JOURNAL OF APPLIED PHYSICS
1999; 85 (10): 7130-7134
View details for Web of Science ID 000080136000019
-
Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating
THIN SOLID FILMS
1999; 339 (1-2): 160-164
View details for Web of Science ID 000079008300027
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Heat conduction in novel electronic films
ANNUAL REVIEW OF MATERIALS SCIENCE
1999; 29: 261-293
View details for Web of Science ID 000082534400009
- Phonon Scattering in Silicon Films of Thickness Below 100 nm Applied Physics Letters 1999; 74: 3005-3007
- Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films Journal of Applied Physics 1999; 86: 1925-1931
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Transient liquid crystal thermometry of microfabricated PCR vessel arrays
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
1998; 7 (4): 345-355
View details for Web of Science ID 000077401800001
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Precision measurement and mapping of die-attach thermal resistance
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A
1998; 21 (3): 506-514
View details for Web of Science ID 000076416500015
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Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1998; 120 (2): 306-313
View details for Web of Science ID 000074007000002
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Thermal characterization of IC passivation layers using Joule heating and optical thermometry
MICROSCALE THERMOPHYSICAL ENGINEERING
1998; 2 (2): 101-110
View details for Web of Science ID 000074152500004
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Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
1998; 7 (1): 69-78
View details for Web of Science ID 000073005900009
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Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries
DIAMOND AND RELATED MATERIALS
1998; 7 (1): 1-14
View details for Web of Science ID 000072061900001
- Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique ASME Journal of Heat Transfer 1998; 120: 306-313
- Precision Measurement and Mapping of Die-Attach Thermal Resistance IEEE Transactions on Components, Packaging, and Manufacturing Technology 1998; A21: 506-514
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Thermal mapping of interconnects subjected to brief electrical stresses
IEEE ELECTRON DEVICE LETTERS
1997; 18 (11): 512-514
View details for Web of Science ID A1997YD00300002
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Impact of nucleation density on thermal resistance near diamond-substrate boundaries
JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER
1997; 11 (4): 506-512
View details for Web of Science ID A1997YA62200003
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Phonon-boundary scattering in thin silicon layers
APPLIED PHYSICS LETTERS
1997; 71 (13): 1798-1800
View details for Web of Science ID A1997XY99300018
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Heating mechanisms of LDMOS and LIGBT in ultrathin SOI
IEEE ELECTRON DEVICE LETTERS
1997; 18 (9): 414-416
View details for Web of Science ID A1997XR89300004
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Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions
JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS
1997; 36 (6B): L798-L800
View details for Web of Science ID A1997XG03200021
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Short-timescale thermal mapping of semiconductor devices
IEEE ELECTRON DEVICE LETTERS
1997; 18 (5): 169-171
View details for Web of Science ID A1997WU99600001
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Improved heat sinking for laser-diode arrays using microchannels in CVD diamond
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING
1997; 20 (1): 104-109
View details for Web of Science ID A1997WH03400014
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Thermal conduction in nonhomogeneous CVD diamond layers in electronic microstructures
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1996; 118 (2): 279-286
View details for Web of Science ID A1996UQ31000001
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PREDICTION AND MEASUREMENT OF TEMPERATURE-FIELDS IN SILICON-ON-INSULATOR ELECTRONIC-CIRCUITS
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1995; 117 (3): 574-581
View details for Web of Science ID A1995RX54700003
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THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES
APPLIED PHYSICS LETTERS
1995; 66 (23): 3134-3136
View details for Web of Science ID A1995RB34700017
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EXPERIMENTAL INVESTIGATION OF THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES
JOURNAL OF APPLIED PHYSICS
1995; 77 (4): 1385-1392
View details for Web of Science ID A1995QG50000004
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THERMAL CONDUCTION IN METALLIZED SILICON-DIOXIDE LAYERS ON SILICON
APPLIED PHYSICS LETTERS
1994; 65 (13): 1629-1631
View details for Web of Science ID A1994PH33200009
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PREDICTION AND MEASUREMENT OF THE THERMAL-CONDUCTIVITY OF AMORPHOUS DIELECTRIC LAYERS
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1994; 116 (2): 317-324
View details for Web of Science ID A1994NP56200005
- Measurement and Modeling of Self-Heating in SOI nMOSFETS IEEE Transactions on Electron Devices 1994; 41: 69-75
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MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS
IEEE TRANSACTIONS ON ELECTRON DEVICES
1994; 41 (1): 69-75
View details for Web of Science ID A1994MU75400011
- Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits Thermal Science and Engineering 1994; 2: 191-201
- Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers ASME Journal of Heat Transfer 1994; 116: 317-324
- Solid-Layer Thermal-Conductivity Measurement Techniques Applied Mechanics Reviews 1994; 47: 101-112
- Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon Applied Physics Letters 1994; 65: 1629-1631
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INTRINSIC SUPERCONDUCTING RADIATION DETECTOR
APPLIED PHYSICS LETTERS
1993; 62 (22): 2862-2864
View details for Web of Science ID A1993LE35300041
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ELECTRON AND PHONON THERMAL CONDUCTION IN EPITAXIAL HIGH-TC SUPERCONDUCTING FILMS
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1993; 115 (1): 17-25
View details for Web of Science ID A1993KP91000003
- Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers IEEE Electron Device Letters 1993; 14: 490-492
- Intrinsic Superconducting Radiation Detector Applied Physics Letters 1993; 62: 2862-2864
- Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films ASME Journal of Heat Transfer 1993; 115: 17-25
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EFFECT OF MICROSCALE THERMAL CONDUCTION ON THE PACKING LIMIT OF SILICON-ON-INSULATOR ELECTRONIC DEVICES
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY
1992; 15 (5): 715-722
View details for Web of Science ID A1992KD69800014
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HEAT-TRANSFER REGIMES IN MICROSTRUCTURES
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1992; 114 (3): 666-674
View details for Web of Science ID A1992JL49100017
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THERMAL-ANALYSIS OF ELECTRON-BEAM ABSORPTION IN LOW-TEMPERATURE SUPERCONDUCTING FILMS
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
1992; 114 (1): 264-270
View details for Web of Science ID A1992HP76200035
- The Electron Scattering Rate in Epitaxial YBa2Cu3O7 Superconducting Films Physical Review B 1992; 46: 5606-5614
- Thermal Analysis of Electron-Beam Absorption in Low-Temperature Superconducting Films ASME Journal of Heat Transfer 1992; 114: 264-270