Bio

Ken Goodson chairs the Mechanical Engineering Department and holds the Davies Family Provostial Professorship. He is a heat transfer specialist with interests ranging from electronics cooling to waste heat harvesting. His lab pioneered phonon free path measurements using silicon nanolayers and has highly-cited papers on conduction physics & metrology, novel conduction materials, and microfluidic heat sinks. Current projects are extending the extreme heat flux limits for power electronics and exploring thermoelectric-powered silicon sensors for buildings.

Nearly half of Goodson's 40 PhD alumni are tenure-track professors at MIT, UC Berkeley, Stanford, and other schools. Goodson is a Fellow with ASME, IEEE, APS, and AAAS. Recognition includes the Kraus Thermal Management Medal and the Heat Transfer Memorial Award from ASME, the AIChE Kern Heat Transfer Award, the IEEE THERMI Award, the SRC Technical Excellence Award, and, in 2015, named lectureships at MIT, Purdue, and the University of Illinois Urbana-Champaign. Goodson co-founded Cooligy, which developed heat sinks for the Apple G5 and was acquired by Emerson in 2006.

Goodson performs as a baritone oratorio soloist in the San Francisco Bay Area, most frequently with the Stanford Symphonic Chorus and the San Francisco Choral Society. Goodson's wife, Laura Dahl, is a member of the Stanford piano faculty.

Academic Appointments

Administrative Appointments

  • Presidential Search Committee, Stanford University (2015 - 2016)
  • Department Chair (Bosch Chair), Mechanical Engineering (2013 - Present)
  • Vice Department Chair, Mechanical Engineering (2008 - 2013)
  • Associate Chair, Graduate Curriculum, Mechanical Engineering (2007 - 2008)
  • Associate Chair, Graduate Admissions, Mechanical Engineering (2005 - 2006)

Honors & Awards

  • Aisinjioro-Soo Distinguished Lectureship, University of Illinois Urbana-Champaign (2015)
  • Donald Q. Kern Heat Transfer Award, AIChE (2015)
  • Hawkins Memorial Lectureship, Purdue University (2015)
  • Rohsenow Lectureship, MIT (2015)
  • Fellow, ASME, IEEE, APS, AAAS (2014)
  • Heat Transfer Memorial Award for Science, ASME (2014)
  • Technical Excellence Award, Semiconductor Research Corporation (2014)
  • THERMI Award, IEEE (2013)
  • Best/Outstanding Paper, ITHERM, SemiTherm, IEDM (2012, 2001, 1992)
  • Golden/Outstanding Reviewer, IEEE, ASME (2010, 1999)
  • Dusinberre Lectureship, Penn State University (2010)
  • Kraus Thermal Management Medal, ASME (2010)
  • Plenary Lectures, ITHERM, PHONONS, InterPack, Therminic, SemiTherm (2006-2013)
  • CAREER Award, National Science Foundation (1996)
  • JSPS Visiting Professorship, Tokyo Institute of Technology (1996)
  • Young Investigator Award, Office of Naval Research (1996)
  • Fellow in Voice, Tanglewood Music Festival (1990, 1991)
  • Graduate Fellowship, Office of Naval Research (1989-1992)
  • Luis Sudler Prize, MIT (1989)
  • Tau Beta Pi, Phi Beta Kappa, Burchard Scholar, MIT (1988, 1989)

Boards, Advisory Committees, Professional Organizations

  • ASME (Fellow), IEEE (Fellow), APS (Fellow), AAAS (Fellow) (2010 - Present)
  • Chief Editor, Nanoscale & Microscale Thermophysical Engineering (2007 - 2012)
  • Associate Editor, Journal of Heat Transfer (2008 - 2012)
  • Member, Tau Beta Pi, Phi Beta Kappa, Sigma Xi (1989 - Present)

Professional Education

  • PhD, MIT, Mechanical Engineering (1993)
  • MS, MIT, Mechanical Engineering (1991)
  • BS, MIT, Humanities (Music) (1989)
  • BS, MIT, Mechanical Engineering (1989)

Patents

  • 34 ISSUED US PATENTS. "."
  • Hu, Jiang, Goodson. " Patent 7,504,453 Composite Thermal Interface Material Including Particles and Nanofibers", Jan 1, 2009
  • Goodson, Kenny, Santiago, et al. " Patent 6,942,018 Electroosmotic Microchannel Cooling System", Jan 1, 2005
  • Zachai, Gutheit, Goodson. " Patent 5,843,224 Composite Structure comprising a Semiconductor Layer arranged on a Diamond...", Jan 1, 1998

Contact

Links

Current Research and Scholarly Interests

We study heat transfer in electronic nanostructures & packaging, microfluidic heat sinks, and thermoelectric & photonic energy conversion devices. Our focus is on fundamental transport phenomena including heat conduction physics and two phase convection. We interact extensively with semiconductor and energy companies.

Current projects include thermoelectric waste heat recovery for vehicles, self-powered sensor networks, and smart buildings. We also study electron and phonon conduction and energy conversion mechanisms in nanostructures including nanolayers and composites. We develop advanced thermal management strategies for the latest computers, tablets, and smart phones. Finally, we have several research initiatives that take high performance heat exchangers to their limits (beyond 50kW/cm2!) through novel phase separation strategies and 3D fluid routing.

Projects

  • Phonon Scattering and Confinement in Nanostructures (NSF)

    Location

    Stanford CA

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  • Phase Separation Microfluidic Cooling (DARPA, IBM)

    Location

    Stanford CA

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  • Thermoelectric Waste Heat Recovery for Vehicles (NSF, DOE, Bosch)

    Location

    Stanford CA

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  • Nanostructured Smart Phone Materials (SRC, Intel)

    Location

    Stanford CA

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  • Electron & Phonon Transport at Interfaces (AFOSR, Raytheon)

    Location

    Stanford CA

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  • Heat Exchangers Technologies for Steam Power Conversion (EPRI)

    Location

    Stanford CA

  • Microfluidic Cooling for Satellites beyond 30kW/cm2 (Boeing)

    Location

    Stanford, CA

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  • Thermoelectric Powered Smart Sensors (Analog Devices)

    Location

    Stanford, CA

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  • Nanostructured Vapor Chambers for Vehicle Technologies (Toyota)

    Location

    Stanford, CA

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2015-16 Courses

Stanford Advisees

All Publications

  • Publication Overview: 190 Journal Articles, 300 Conference Papers, 32 Patents, 9 Book Chapters, 2 Books. 19000 Citations, H = 66 (Google Scholar). 10,000 Citations, H = 51 (Web of Science) Goodson, K. E. 2016
  • Thermal characterization and analysis of microliter liquid volumes using the three-omega method. Review of scientific instruments Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2): 024901-?

    Abstract

    Thermal phenomena in many biological systems offer an alternative detection opportunity for quantifying relevant sample properties. While there is substantial prior work on thermal characterization methods for fluids, the push in the biology and biomedical research communities towards analysis of reduced sample volumes drives a need to extend and scale these techniques to these volumes of interest, which can be below 100 pl. This work applies the 3ω technique to measure the temperature-dependent thermal conductivity and heat capacity of de-ionized water, silicone oil, and salt buffer solution droplets from 24 to 80 °C. Heater geometries range in length from 200 to 700 μm and in width from 2 to 5 μm to accommodate the size restrictions imposed by small volume droplets. We use these devices to measure droplet volumes of 2 μl and demonstrate the potential to extend this technique down to pl droplet volumes based on an analysis of the thermally probed volume. Sensitivity and uncertainty analyses provide guidance for relevant design variables for characterizing properties of interest by investigating the tradeoffs between measurement frequency regime, device geometry, and substrate material. Experimental results show that we can extract thermal conductivity and heat capacity with these sample volumes to within less than 1% of thermal properties reported in the literature.

    View details for DOI 10.1063/1.4907353

    View details for PubMedID 25725871

  • Material and manufacturing cost considerations for thermoelectrics RENEWABLE & SUSTAINABLE ENERGY REVIEWS LeBlanc, S., Yee, S. K., Scullin, M. L., Dames, C., Goodson, K. E. 2014; 32: 313-327

    View details for DOI 10.1016/j.rser.2013.12.030

    View details for Web of Science ID 000333728700027

  • Phonon Scattering in Strained Transition Layers for GaN Heteroepitaxy Physical Review B Cho, j., Li, Y., Hoke, W., Altman, D., Asheghi, M., Goodson, K. E. 2014; 89: 11

    View details for DOI 10.1103/PhysRevB.89.115301

  • Zipping, entanglement, and the elastic modulus of aligned single-walled carbon nanotube films PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA Won, Y., Gao, Y., Panzer, M. A., Xiang, R., Maruyama, S., Kenny, T. W., Cai, W., Goodson, K. E. 2013; 110 (51): 20426-20430

    Abstract

    Reliably routing heat to and from conversion materials is a daunting challenge for a variety of innovative energy technologies--from thermal solar to automotive waste heat recovery systems--whose efficiencies degrade due to massive thermomechanical stresses at interfaces. This problem may soon be addressed by adhesives based on vertically aligned carbon nanotubes, which promise the revolutionary combination of high through-plane thermal conductivity and vanishing in-plane mechanical stiffness. Here, we report the data for the in-plane modulus of aligned single-walled carbon nanotube films using a microfabricated resonator method. Molecular simulations and electron microscopy identify the nanoscale mechanisms responsible for this property. The zipping and unzipping of adjacent nanotubes and the degree of alignment and entanglement are shown to govern the spatially varying local modulus, thereby providing the route to engineered materials with outstanding combinations of mechanical and thermal properties.

    View details for DOI 10.1073/pnas.1312253110

    View details for Web of Science ID 000328548600031

    View details for PubMedID 24309375

  • Thermal conduction phenomena in carbon nanotubes and related nanostructured materials REVIEWS OF MODERN PHYSICS Marconnet, A. M., Panzer, M. A., Goodson, K. E. 2013; 85 (3): 1295-1326

    View details for DOI 10.1103/RevModPhys.85.1295

    View details for Web of Science ID 000323334100001

  • From the Casimir Limit to Phononic Crystals: 20 Years of Phonon Transport Studies Using Silicon-on-Insulator Technology JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 135 (6)

    View details for DOI 10.1115/1.4023577

    View details for Web of Science ID 000326165000012

  • Phonon Dominated Heat Conduction Normal to Mo/Si Multilayers with Period below 10 nm NANO LETTERS Li, Z., Tan, S., Bozorg-Grayeli, E., Kodama, T., Asheghi, M., Delgado, G., Panzer, M., Pokrovsky, A., Wack, D., Goodson, K. E. 2012; 12 (6): 3121-3126

    Abstract

    Thermal conduction in periodic multilayer composites can be strongly influenced by nonequilibrium electron-phonon scattering for periods shorter than the relevant free paths. Here we argue that two additional mechanisms-quasiballistic phonon transport normal to the metal film and inelastic electron-interface scattering-can also impact conduction in metal/dielectric multilayers with a period below 10 nm. Measurements use the 3? method with six different bridge widths down to 50 nm to extract the in- and cross-plane effective conductivities of Mo/Si (2.8 nm/4.1 nm) multilayers, yielding 15.4 and 1.2 W/mK, respectively. The cross-plane thermal resistance is lower than can be predicted considering volume and interface scattering but is consistent with a new model built around a film-normal length scale for phonon-electron energy conversion in the metal. We introduce a criterion for the transition from electron to phonon dominated heat conduction in metal films bounded by dielectrics.

    View details for DOI 10.1021/nl300996r

    View details for Web of Science ID 000305106400078

    View details for PubMedID 22563928

  • Electrical and Thermal Conduction in Atomic Layer Deposition Nanobridges Down to 7 nm Thickness NANO LETTERS Yoneoka, S., Lee, J., Liger, M., Yama, G., Kodama, T., Gunji, M., Provine, J., Howe, R. T., Goodson, K. E., Kennyt, T. W. 2012; 12 (2): 683-686

    Abstract

    While the literature is rich with data for the electrical behavior of nanotransistors based on semiconductor nanowires and carbon nanotubes, few data are available for ultrascaled metal interconnects that will be demanded by these devices. Atomic layer deposition (ALD), which uses a sequence of self-limiting surface reactions to achieve high-quality nanolayers, provides an unique opportunity to study the limits of electrical and thermal conduction in metal interconnects. This work measures and interprets the electrical and thermal conductivities of free-standing platinum films of thickness 7.3, 9.8, and 12.1 nm in the temperature range from 50 to 320 K. Conductivity data for the 7.3 nm bridge are reduced by 77.8% (electrical) and 66.3% (thermal) compared to bulk values due to electron scattering at material and grain boundaries. The measurement results indicate that the contribution of phonon conduction is significant in the total thermal conductivity of the ALD films.

    View details for DOI 10.1021/nl203548w

    View details for Web of Science ID 000299967800026

    View details for PubMedID 22224582

  • Hydraulic and thermal characteristics of a vapor venting two-phase microchannel heat exchanger INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER David, M. P., Miler, J., Steinbrenner, J. E., Yang, Y., Touzelbaev, M., Goodson, K. E. 2011; 54 (25-26): 5504-5516

    View details for DOI 10.1016/j.ijheatmasstransfer.2011.07.040

    View details for Web of Science ID 000296035300037

  • Adiabatic and diabatic two-phase venting flow in a microchannel INTERNATIONAL JOURNAL OF MULTIPHASE FLOW David, M. P., Steinbrenner, J. E., Miler, J., Goodson, K. E. 2011; 37 (9): 1135-1146

    View details for DOI 10.1016/j.ijmultiphaseflow.2011.06.013

    View details for Web of Science ID 000295242200013

  • Impact of channel geometry on two-phase flow in fuel cell microchannels JOURNAL OF POWER SOURCES Steinbrenner, J. E., Lee, E. S., Hidrovo, C. H., Eaton, J. K., Goodson, K. E. 2011; 196 (11): 5012-5020

    View details for DOI 10.1016/j.jpowsour.2011.02.032

    View details for Web of Science ID 000289599900018

  • Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density ACS NANO Marconnett, A. M., Yamamoto, N., Panzer, M. A., Wardle, B. L., Goodson, K. E. 2011; 5 (6): 4818-4825

    View details for DOI 10.1021/nn200847u

    View details for Web of Science ID 000292055200065

  • Phase Change Memory PROCEEDINGS OF THE IEEE Wong, H. P., Raoux, S., Kim, S., Liang, J., Reifenberg, J. P., Rajendran, B., Asheghi, M., Goodson, K. E. 2010; 98 (12): 2201-2227

    View details for DOI 10.1109/JPROC.2010.2070050

    View details for Web of Science ID 000284410800016

  • Characterization of the wettability of thin nanostructured films in the presence of evaporation JOURNAL OF COLLOID AND INTERFACE SCIENCE Rogacs, A., Steinbrenner, J. E., Rowlette, J. A., Weisse, J. M., Zheng, X. L., Goodson, K. E. 2010; 349 (1): 354-360

    Abstract

    Vapor chambers using conventional porous membrane wicks offer limited heat transfer rates for a given thickness. This limitation can be addressed through wick nanostructuring, which promises high capillary pressures and precise control of the local porosity. This work develops a measurement technique for the wettability of nanostructured wicks based on optical imaging. Feasibility is demonstrated on a hydrophilic silicon nanowire array (SiNW) synthesized using the Vapor-Liquid-Solid (VLS) growth mechanism followed by surface plasma treatment. The wettability is determined by comparing the time-dependent liquid interface rise with a model that accounts for capillary, viscous, and gravitational forces and for evaporation. This model is demonstrated to be useful in extracting internal contact angle from thin ( approximately 10microm) porous films.

    View details for DOI 10.1016/j.jcis.2010.05.063

    View details for Web of Science ID 000279966700045

    View details for PubMedID 20579656

  • Nanofluid Convection in Microtubes JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Lee, J., Gharagozloo, P. E., Kolade, B., Eaton, J. K., Goodson, K. E. 2010; 132 (9)

    View details for DOI 10.1115/1.4001637

    View details for Web of Science ID 000279992300016

  • Nonradiative recombination in strongly interacting silicon nanocrystals embedded in amorphous silicon-oxide films PHYSICAL REVIEW B Rowlette, J. A., Kekatpure, R. D., Panzer, M. A., Brongersma, M. L., Goodson, K. E. 2009; 80 (4)

    View details for DOI 10.1103/PhysRevB.80.045314

    View details for Web of Science ID 000268618100073

  • Heat Conduction through a DNA-Gold Composite NANO LETTERS Kodama, T., Jain, A., Goodson, K. E. 2009; 9 (5): 2005-2009

    Abstract

    This paper reports results from electrical and thermal conduction measurements carried out on the DNA-gold composite for which the overall conduction is shown to be dominated by the DNA rather than the discontinuous gold coatings. The electrical and thermal conductivities of the composite were about 14 S/cm and 150 W/(m K) at room temperature, respectively. The resulting value of 3.6 x 10(-4) W ohms/K(2) for the Lorentz number indicates that thermal transport in the DNA is phonon-dominated and that the molecular vibrations play a key role in both electrical and thermal conduction processes of DNA molecules.

    View details for DOI 10.1021/nl900272m

    View details for Web of Science ID 000266157100049

    View details for PubMedID 19435380

  • Ordering up the Minimum Thermal Conductivity of Solids SCIENCE Goodson, K. E. 2007; 315: 342-343
  • Heat generation and transport in nanometer-scale transistors PROCEEDINGS OF THE IEEE Pop, E., Sinha, S., Goodson, K. E. 2006; 94 (8): 1587-1601

    View details for DOI 10.1109/JPROC.2006.879794

    View details for Web of Science ID 000240963400010

  • Burst behavior at a capillary tip: Effect of low and high surface tension JOURNAL OF COLLOID AND INTERFACE SCIENCE Agonafer, D. D., Lopez, K., Palko, J. W., Won, Y., Santiago, J. G., Goodson, K. E. 2015; 455: 1-5

    Abstract

    Liquid retention in micron and millimeter scale devices is important for maintaining stable interfaces in various processes including bimolecular separation, phase change heat transfer, and water desalination. There have been several studies of re-entrant geometries, and very few studies on retaining low surface tension liquids such as fluorocarbon-based dielectric liquids. Here, we study retention of a liquid with very low contact angles using borosilicate glass capillary tips. We analyzed capillary tips with outer diameters ranging from 250 to 840μm and measured Laplace pressures up to 2.9kPa. Experimental results agree well with a numerical model that predicts burst pressure (the maximum Laplace pressure for liquid retention), which is a function of the outer diameter (D) and capillary exit edge radius of curvature (r).

    View details for DOI 10.1016/j.jcis.2015.05.033

    View details for Web of Science ID 000357544700001

    View details for PubMedID 26046980

  • Thermal Conduction in Vertically Aligned Copper Nanowire Arrays and Composites ACS APPLIED MATERIALS & INTERFACES Barako, M. T., Roy-Panzer, S., English, T. S., Kodama, T., Asheghi, M., Kenny, T. W., Goodson, K. E. 2015; 7 (34): 19251-19259

    Abstract

    The ability to efficiently and reliably transfer heat between sources and sinks is often a bottleneck in the thermal management of modern energy conversion technologies ranging from microelectronics to thermoelectric power generation. These interfaces contribute parasitic thermal resistances that reduce device performance and are subjected to thermomechanical stresses that degrade device lifetime. Dense arrays of vertically aligned metal nanowires (NWs) offer the unique combination of thermal conductance from the constituent metal and mechanical compliance from the high aspect ratio geometry to increase interfacial heat transfer and device reliability. In the present work, we synthesize copper NW arrays directly onto substrates via templated electrodeposition and extend this technique through the use of a sacrificial overplating layer to achieve improved uniformity. Furthermore, we infiltrate the array with an organic phase change material and demonstrate the preservation of thermal properties. We use the 3ω method to measure the axial thermal conductivity of freestanding copper NW arrays to be as high as 70 W m(-1) K(-1), which is more than an order of magnitude larger than most commercial interface materials and enhanced-conductivity nanocomposites reported in the literature. These arrays are highly anisotropic, and the lateral thermal conductivity is found to be only 1-2 W m(-1) K(-1). We use these measured properties to elucidate the governing array-scale transport mechanisms, which include the effects of morphology and energy carrier scattering from size effects and grain boundaries.

    View details for DOI 10.1021/acsami.5b05147

    View details for Web of Science ID 000360868700045

    View details for PubMedID 26284489

  • Cross-Plane Phonon Conduction in Polycrystalline Silicon Films JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cho, J., Francis, D., Chao, P. C., Asheghi, M., Goodson, K. E. 2015; 137 (7)

    View details for DOI 10.1115/1.4029820

    View details for Web of Science ID 000357585200003

  • Fundamental Cooling Limits for High Power Density Gallium Nitride Electronics IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Won, Y., Cho, J., Agonafer, D., Asheghi, M., Goodson, K. E. 2015; 5 (6): 737-744

    View details for DOI 10.1109/TCPMT.2015.2433132

    View details for Web of Science ID 000356699700004

  • Evaluating Broader Impacts of Nanoscale Thermal Transport Research NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Shi, L., Dames, C., Lukes, J. R., Reddy, P., Duda, J., Cahill, D. G., Lee, J., Marconnet, A., Goodson, K. E., Bahk, J., Shakouri, A., Prasher, R. S., Felts, J., King, W. P., Han, B., Bischof, J. C. 2015; 19 (2): 127-165

    View details for DOI 10.1080/15567265.2015.1031857

    View details for Web of Science ID 000355741500003

  • Thermal characterization and analysis of microliter liquid volumes using the three-omega method REVIEW OF SCIENTIFIC INSTRUMENTS Roy-Panzer, S., Kodama, T., Lingamneni, S., Panzer, M. A., Asheghi, M., Goodson, K. E. 2015; 86 (2)

    View details for DOI 10.1063/1.4907353

    View details for Web of Science ID 000350552700055

  • Reactive Metal Bonding of Carbon Nanotube Arrays for Thermal Interface Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Barako, M. T., Gao, Y., Won, Y., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2014; 4 (12): 1906-1913

    View details for DOI 10.1109/TCPMT.2014.2369371

    View details for Web of Science ID 000348122800001

  • Thermal conduction in lattice-matched superlattices of InGaAs/InAlAs APPLIED PHYSICS LETTERS Sood, A., Rowlette, J. A., Caneau, C. G., Bozorg-Grayeli, E., Asheghi, M., Goodson, K. E. 2014; 105 (5)

    View details for DOI 10.1063/1.4892575

    View details for Web of Science ID 000341153000028

  • Ultrafast Characterization of Phase-Change Material Crystallization Properties in the Melt-Quenched Amorphous Phase NANO LETTERS Jeyasingh, R., Fong, S. W., Lee, J., Li, Z., Chang, K., Mantegazza, D., Asheghi, M., Goodson, K. E., Wong, H. P. 2014; 14 (6): 3419-3426

    Abstract

    Phase change materials are widely considered for application in nonvolatile memories because of their ability to achieve phase transformation in the nanosecond time scale. However, the knowledge of fast crystallization dynamics in these materials is limited because of the lack of fast and accurate temperature control methods. In this work, we have developed an experimental methodology that enables ultrafast characterization of phase-change dynamics on a more technologically relevant melt-quenched amorphous phase using practical device structures. We have extracted the crystallization growth velocity (U) in a functional capped phase change memory (PCM) device over 8 orders of magnitude (10(-10) < U < 10(-1) m/s) spanning a wide temperature range (415 < T < 580 K). We also observed direct evidence of non-Arrhenius crystallization behavior in programmed PCM devices at very high heating rates (>10(8) K/s), which reveals the extreme fragility of Ge2Sb2Te5 in its supercooled liquid phase. Furthermore, these crystallization properties were studied as a function of device programming cycles, and the results show degradation in the cell retention properties due to elemental segregation. The above experiments are enabled by the use of an on-chip fast heater and thermometer called as microthermal stage (MTS) integrated with a vertical phase change memory (PCM) cell. The temperature at the PCM layer can be controlled up to 600 K using MTS and with a thermal time constant of 800 ns, leading to heating rates ∼10(8) K/s that are close to the typical device operating conditions during PCM programming. The MTS allows us to independently control the electrical and thermal aspects of phase transformation (inseparable in a conventional PCM cell) and extract the temperature dependence of key material properties in real PCM devices.

    View details for DOI 10.1021/nl500940z

    View details for Web of Science ID 000337337100068

    View details for PubMedID 24798660

  • Analysis of Oxide (Al2O3, CuO, and ZnO) and CNT Nanoparticles Disaggregation Effect on the Thermal Conductivity and the Viscosity of Nanofluids INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING Lee, J., Yoon, Y., Eaton, J. K., Goodson, K. E., Bai, S. J. 2014; 15 (4): 703-710

    View details for DOI 10.1007/s12541-014-0390-1

    View details for Web of Science ID 000333866300015

  • Nanoscale thermal transport. II. 2003-2012 APPLIED PHYSICS REVIEWS Cahill, D. G., Braun, P. V., Chen, G., Clarke, D. R., Fan, S., Goodson, K. E., Keblinski, P., King, W. P., Mahan, G. D., Majumdar, A., Maris, H. J., Phillpot, S. R., Pop, E., Shi, L. 2014; 1 (1)

    View details for DOI 10.1063/1.4832615

    View details for Web of Science ID 000334098500010

  • Nanoscale Thermal Transport Applied Physics Reviews Cahill, D., G., Braun, P., V., Chen, G., Clarke, D., R., Goodson, K., E., Keblinski, P. 2014; 1: 011305
  • PHONON CONDUCTION NORMAL TO POLYSILICON FILMS ON DIAMOND PROCEEDINGS OF THE ASME 4TH INTERNATIONAL CONFERENCE ON MICRO/NANOSCALE HEAT AND MASS TRANSFER - 2013 Cho, J., Chao, P. C., Asheghi, M., Goodson, K. E. 2014

    View details for Web of Science ID 000349928000027

  • $ per W metrics for thermoelectric power generation: beyond ZT ENERGY & ENVIRONMENTAL SCIENCE Yee, S. K., LeBlanc, S., Goodson, K. E., Dames, C. 2013; 6 (9): 2561-2571

    View details for DOI 10.1039/c3ee41504j

    View details for Web of Science ID 000323198100001

  • High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices JOURNAL OF ELECTRONIC PACKAGING Touzelbaev, M. N., Miler, J., Yang, Y., Refai-Ahmed, G., Goodson, K. E. 2013; 135 (3)

    View details for DOI 10.1115/1.4024747

    View details for Web of Science ID 000326095800010

  • Heat Capacity, Thermal Conductivity, and Interface Resistance Extraction for Single-Walled Carbon Nanotube Films Using Frequency-Domain Thermoreflectance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Gao, Y., Marconnet, A. M., Xiang, R., Maruyama, S., Goodson, K. E. 2013; 3 (9): 1524-1532

    View details for DOI 10.1109/TCPMT.2013.2254175

    View details for Web of Science ID 000324384600010

  • Phonon and electron transport through Ge2Sb2Te5 films and interfaces bounded by metals APPLIED PHYSICS LETTERS Lee, J., Bozorg-Grayeli, E., Kim, S., Asheghi, M., Wong, H. P., Goodson, K. E. 2013; 102 (19)

    View details for DOI 10.1063/1.4807141

    View details for Web of Science ID 000320440800035

  • Thermal conduction inhomogeneity of nanocrystalline diamond films by dual-side thermoreflectance APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Sood, A., Asheghi, M., Gambin, V., Sandhu, R., Feygelson, T. I., Pate, B. B., Hobart, K., Goodson, K. E. 2013; 102 (11)

    View details for DOI 10.1063/1.4796168

    View details for Web of Science ID 000316544900032

  • Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module JOURNAL OF ELECTRONIC MATERIALS Barako, M. T., Park, W., Marconnet, A. M., Asheghi, M., Goodson, K. E. 2013; 42 (3): 372-381

    View details for DOI 10.1007/s11664-012-2366-1

    View details for Web of Science ID 000314529300004

  • Improved Thermal Interfaces of GaN-Diamond Composite Substrates for HEMT Applications IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY Cho, J., Li, Z., Bozorg-Grayeli, E., Kodama, T., Francis, D., Ejeckam, F., Faili, F., Asheghi, M., Goodson, K. E. 2013; 3 (1): 79-85

    View details for DOI 10.1109/TCPMT.2012.2223818

    View details for Web of Science ID 000313687100010

  • Electrothermal Modeling and Design Strategies for Multibit Phase-Change Memory IEEE TRANSACTIONS ON ELECTRON DEVICES Li, Z., Jeyasingh, R. G., Lee, J., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 59 (12): 3561-3567

    View details for DOI 10.1109/TED.2012.2219311

    View details for Web of Science ID 000311680400060

  • Phonon Conduction in Periodically Porous Silicon Nanobridges NANOSCALE AND MICROSCALE THERMOPHYSICAL ENGINEERING Marconnet, A. M., Kodama, T., Asheghi, M., Goodson, K. E. 2012; 16 (4): 199-219

    View details for DOI 10.1080/15567265.2012.732195

    View details for Web of Science ID 000311949300001

  • Thermal conduction properties of Mo/Si multilayers for extreme ultraviolet optics JOURNAL OF APPLIED PHYSICS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2012; 112 (8)

    View details for DOI 10.1063/1.4759450

    View details for Web of Science ID 000310597500020

  • Thermal conductivity in porous silicon nanowire arrays NANOSCALE RESEARCH LETTERS Weisse, J. M., Marconnet, A. M., Kim, D. R., Rao, P. M., Panzer, M. A., Goodson, K. E., Zheng, X. 2012; 7

    Abstract

    The nanoscale features in silicon nanowires (SiNWs) can suppress phonon propagation and strongly reduce their thermal conductivities compared to the bulk value. This work measures the thermal conductivity along the axial direction of SiNW arrays with varying nanowire diameters, doping concentrations, surface roughness, and internal porosities using nanosecond transient thermoreflectance. For SiNWs with diameters larger than the phonon mean free path, porosity substantially reduces the thermal conductivity, yielding thermal conductivities as low as 1 W/m/K in highly porous SiNWs. However, when the SiNW diameter is below the phonon mean free path, both the internal porosity and the diameter significantly contribute to phonon scattering and lead to reduced thermal conductivity of the SiNWs.

    View details for DOI 10.1186/1556-276X-7-554

    View details for Web of Science ID 000311320400001

    View details for PubMedID 23039084

  • Nanoscale Manipulation, Heating, and Welding of Nanowires JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME LeBlanc, S., Swartzentruber, B., Martinez, J., Christoforo, G., Kodama, T., Goodson, K. E. 2012; 134 (8)

    View details for Web of Science ID 000306143200010

  • Impact of nanotube density and alignment on the elastic modulus near the top and base surfaces of aligned multi-walled carbon nanotube films CARBON Gao, Y., Kodama, T., Won, Y., Dogbe, S., Pan, L., Goodson, K. E. 2012; 50 (10): 3789-3798

    View details for DOI 10.1016/j.carbon.2012.04.004

    View details for Web of Science ID 000305851700050

  • Phase purity and the thermoelectric properties of Ge2Sb2Te5 films down to 25 nm thickness JOURNAL OF APPLIED PHYSICS Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K. E. 2012; 112 (1)

    View details for DOI 10.1063/1.4731252

    View details for Web of Science ID 000306513400151

  • Impact of thermoelectric phenomena on phase-change memory performance metrics and scaling NANOTECHNOLOGY Lee, J., Asheghi, M., Goodson, K. E. 2012; 23 (20)

    Abstract

    The coupled transport of heat and electrical current, or thermoelectric phenomena, can strongly influence the temperature distribution and figures of merit for phase-change memory (PCM). This paper simulates PCM devices with careful attention to thermoelectric transport and the resulting impact on programming current during the reset operation. The electrothermal simulations consider Thomson heating within the phase-change material and Peltier heating at the electrode interface. Using representative values for the Thomson and Seebeck coefficients extracted from our past measurements of these properties, we predict a cell temperature increase of 44% and a decrease in the programming current of 16%. Scaling arguments indicate that the impact of thermoelectric phenomena becomes greater with smaller dimensions due to enhanced thermal confinement. This work estimates the scaling of this reduction in programming current as electrode contact areas are reduced down to 10 nm × 10 nm. Precise understanding of thermoelectric phenomena and their impact on device performance is a critical part of PCM design strategies.

    View details for DOI 10.1088/0957-4484/23/20/205201

    View details for Web of Science ID 000303531400004

    View details for PubMedID 22543873

  • Phase and thickness dependent modulus of Ge2Sb2Te5 films down to 25 nm thickness APPLIED PHYSICS LETTERS Won, Y., Lee, J., Asheghi, M., Kenny, T. W., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.3699227

    View details for Web of Science ID 000303128500018

  • Electrothermal phenomena in zinc oxide nanowires and contacts APPLIED PHYSICS LETTERS LeBlanc, S., Phadke, S., Kodama, T., Salleo, A., Goodson, K. E. 2012; 100 (16)

    View details for DOI 10.1063/1.4703935

    View details for Web of Science ID 000303128500048

  • Low Thermal Resistances at GaN-SiC Interfaces for HEMT Technology IEEE ELECTRON DEVICE LETTERS Cho, J., Bozorg-Grayeli, E., Altman, D. H., Asheghi, M., Goodson, K. E. 2012; 33 (3): 378-380

    View details for DOI 10.1109/LED.2011.2181481

    View details for Web of Science ID 000300580000026

  • Effect of Resistance Drift on the Activation Energy for Crystallization in Phase Change Memory JAPANESE JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, F., Goodson, K. E., Wong, H. P. 2012; 51 (2)

    View details for DOI 10.1143/JJAP.51.02BD06

    View details for Web of Science ID 000303481400028

  • Thermoelectric Characterization and Power Generation Using a Silicon-on-Insulator Substrate JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Lee, J., Kim, S., Marconnet, A., in't Zandt, M. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2012; 21 (1): 4-6

    View details for DOI 10.1109/JMEMS.2011.2175704

    View details for Web of Science ID 000300104600001

  • Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators CARBON Won, Y., Gao, Y., Panzer, M. A., Dogbe, S., Pan, L., Kenny, T. W., Goodson, K. E. 2012; 50 (2): 347-355

    View details for DOI 10.1016/j.carbon.2011.08.009

    View details for Web of Science ID 000297397700001

  • Thermal conductivity and photoluminescence of light-emitting silicon nitride films APPLIED PHYSICS LETTERS Marconnet, A., Panzer, M., Yerci, S., Minissale, S., Wang, X., Zhang, X., Dal Negro, L., Goodson, K. E. 2012; 100 (5)

    View details for DOI 10.1063/1.3682508

    View details for Web of Science ID 000300065300023

  • Phase and Temperature Dependent Thermoelectric Properties of Ge2Sb2Te5 Films down to 25 nm Thickness Journal of Applied Physics Lee, J., Kodama, T., Won, Y., Asheghi, M., Goodson, K., E. 2012; 112: 014902
  • High temperature thermal properties of thin tantalum nitride films APPLIED PHYSICS LETTERS Bozorg-Grayeli, E., Li, Z., Asheghi, M., Delgado, G., Pokrovsky, A., Panzer, M., Wack, D., Goodson, K. E. 2011; 99 (26)

    View details for DOI 10.1063/1.3672098

    View details for Web of Science ID 000298638500022

  • Crystallization properties and their drift dependence in phase-change memory studied with a micro-thermal stage JOURNAL OF APPLIED PHYSICS Ahn, C., Lee, B., Jeyasingh, R. G., Asheghi, M., Hurkx, G. A., Goodson, K. E., Wong, H. P. 2011; 110 (11)

    View details for DOI 10.1063/1.3667295

    View details for Web of Science ID 000298254800159

  • Temperature-Dependent Thermal Properties of Phase-Change Memory Electrode Materials IEEE ELECTRON DEVICE LETTERS Bozorg-Grayeli, E., Reifenberg, J. P., Panzer, M. A., Rowlette, J. A., Goodson, K. E. 2011; 32 (9): 1281-1283

    View details for DOI 10.1109/LED.2011.2158796

    View details for Web of Science ID 000294171600039

  • Microthermal Stage for Electrothermal Characterization of Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H. P., Goodson, K. E. 2011; 32 (7): 952-954

    View details for DOI 10.1109/LED.2011.2144952

    View details for Web of Science ID 000292165200040

  • Grain Boundaries, Phase Impurities, and Anisotropic Thermal Conduction in Phase-Change Memory IEEE ELECTRON DEVICE LETTERS Li, Z., Lee, J., Reifenberg, J. P., Asheghi, M., Jeyasingh, R. G., Wong, H. P., Goodson, K. E. 2011; 32 (7): 961-963

    View details for DOI 10.1109/LED.2011.2150193

    View details for Web of Science ID 000292165200043

  • Thermal microdevices for biological and biomedical applications JOURNAL OF THERMAL BIOLOGY Jain, A., Goodson, K. E. 2011; 36 (4): 209-218

    View details for DOI 10.1016/j.jtherbio.2011.02.006

    View details for Web of Science ID 000292174200001

  • Thermal conductivity anisotropy and grain structure in Ge2Sb2Te5 films JOURNAL OF APPLIED PHYSICS Lee, J., Li, Z., Reifenberg, J. P., Lee, S., Sinclair, R., Asheghi, M., Goodson, K. E. 2011; 109 (8)

    View details for DOI 10.1063/1.3573505

    View details for Web of Science ID 000290047000229

  • Resistance and Threshold Switching Voltage Drift Behavior in Phase-Change Memory and Their Temperature Dependence at Microsecond Time Scales Studied Using a Micro-Thermal Stage IEEE TRANSACTIONS ON ELECTRON DEVICES Kim, S., Lee, B., Asheghi, M., Hurkx, F., Reifenberg, J. P., Goodson, K. E., Wong, H. P. 2011; 58 (3): 584-592

    View details for DOI 10.1109/TED.2010.2095502

    View details for Web of Science ID 000287665700001

  • 3-D visualization of flow in microscale jet impingement systems INTERNATIONAL JOURNAL OF THERMAL SCIENCES Won, Y., Wang, E. N., Goodson, K. E., Kenny, T. W. 2011; 50 (3): 325-331

    View details for DOI 10.1016/j.ijthermalsci.2010.08.005

    View details for Web of Science ID 000287285700012

  • Thermal resistance between low-dimensional nanostructures and semi-infinite media (vol 103, 094301, 2008) JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2011; 109 (5)

    View details for DOI 10.1063/1.3558984

    View details for Web of Science ID 000288387900131

  • Temperature-dependent aggregation and diffusion in nanofluids INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Gharagozloo, P. E., Goodson, K. E. 2011; 54 (4): 797-806

    View details for DOI 10.1016/j.ijheatmasstransfer.2010.06.058

    View details for Web of Science ID 000287054800007

  • Micro Thermal Stage for Electrothermal Characterization of Phase Change Memory IEEE Electron Device Letters Lee, J., Kim, S., Jeyasingh, R., Asheghi, M., Wong, H.S., P., Goodson, K., E. 2011; 32: 952-954
  • Aggregate fractal dimensions and thermal conduction in nanofluids JOURNAL OF APPLIED PHYSICS Gharagozloo, P. E., Goodson, K. E. 2010; 108 (7)

    View details for DOI 10.1063/1.3481423

    View details for Web of Science ID 000283222200125

  • Influence of film thickness and cross-sectional geometry on hydrophilic microchannel condensation INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., David, M., Wang, F., Goodson, K. E. 2010; 36 (8): 608-619

    View details for DOI 10.1016/j.ijmultiphaseflow.2010.04.005

    View details for Web of Science ID 000279954300002

  • Temperature-Dependent Phonon Conduction and Nanotube Engagement in Metalized Single Wall Carbon Nanotube Films NANO LETTERS Panzer, M. A., Duong, H. M., Okawa, J., Shiomi, J., Wardle, B. L., Maruyama, S., Goodson, K. E. 2010; 10 (7): 2395-2400

    Abstract

    Interfaces dominate the thermal resistances in aligned carbon nanotube arrays. This work uses nanosecond thermoreflectance thermometry to separate interface and volume resistances for 10 microm thick aligned SWNT films coated with Al, Ti, Pd, Pt, and Ni. We interpret the data by defining the nanotube-metal engagement factor, which governs the interface resistance and is extracted using the measured film heat capacity. The metal-SWNT and SWNT-substrate resistances range between 3.8 and 9.2 mm(2)K/W and 33-46 mm(2)K/W, respectively. The temperature dependency of the heat capacity data, measured between 125 and 300 K, is in good agreement with theoretical predictions. The temperature dependence demonstrated by the metal-SWNT interface resistance data suggests inelastic phonon transmission.

    View details for DOI 10.1021/nl100443x

    View details for Web of Science ID 000280416200017

    View details for PubMedID 20503983

  • Impact of wall hydrophobicity on condensation flow and heat transfer in silicon microchannels JOURNAL OF MICROMECHANICS AND MICROENGINEERING Fang, C., Steinbrenner, J. E., Wang, F., Goodson, K. E. 2010; 20 (4)

    View details for DOI 10.1088/0960-1317/20/4/045018

    View details for Web of Science ID 000275841800019

  • Thermal Boundary Resistance Measurements for Phase-Change Memory Devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Chang, K., Panzer, M. A., Kim, S., Rowlette, J. A., Asheghi, M., Wong, H. P., Goodson, K. E. 2010; 31 (1): 56-58

    View details for DOI 10.1109/LED.2009.2035139

    View details for Web of Science ID 000273090800020

  • SUPERIOR THERMAL INTERFACES MADE BY METALLICALLY ANCHORED CARBON NANOTUBE ARRAYS IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 2 Hu, X., Pan, L. S., Gu, G., Goodson, K. E. 2010: 597-603

    View details for Web of Science ID 000282288900073

  • Volume of Fluid Simulation of Boiling Flow in a Vapor-Venting Microchannel Frontiers of Heat and Mass Transfer Fang, C., David, M., Rogacs, A., Goodson, K., E. 2010; 1: 013002
  • Theoretical and experimental investigation of spatial temperature gradient effects on cells using a microfabricated microheater platform SENSORS AND ACTUATORS B-CHEMICAL Jain, A., Ness, K., Goodson, K. E. 2009; 143 (1): 286-294

    View details for DOI 10.1016/j.snb.2009.08.035

    View details for Web of Science ID 000272376800043

  • Bubble-Induced Water Hammer and Cavitation in Microchannel Flow Boiling JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Fogg, D. W., Goodson, K. E. 2009; 131 (12)

    View details for DOI 10.1115/1.3216381

    View details for Web of Science ID 000271905600007

  • Thermal Properties of Ultrathin Hafnium Oxide Gate Dielectric Films IEEE ELECTRON DEVICE LETTERS Panzer, M. A., Shandalov, M., Rowlette, J. A., Oshima, Y., Chen, Y. W., McIntyre, P. C., Goodson, K. E. 2009; 30 (12): 1269-1271

    View details for DOI 10.1109/LED.2009.2032937

    View details for Web of Science ID 000272044500007

  • A benchmark study on the thermal conductivity of nanofluids JOURNAL OF APPLIED PHYSICS Buongiorno, J., Venerus, D. C., Prabhat, N., McKrell, T., Townsend, J., Christianson, R., Tolmachev, Y. V., Keblinski, P., Hu, L., Alvarado, J. L., Bang, I. C., Bishnoi, S. W., Bonetti, M., Botz, F., Cecere, A., Chang, Y., Chen, G., Chen, H., Chung, S. J., Chyu, M. K., Das, S. K., Di Paola, R., Ding, Y., Dubois, F., Dzido, G., Eapen, J., Escher, W., Funfschilling, D., Galand, Q., Gao, J., Gharagozloo, P. E., Goodson, K. E., Gutierrez, J. G., Hong, H., Horton, M., Hwang, K. S., Iorio, C. S., Jang, S. P., Jarzebski, A. B., Jiang, Y., Jin, L., Kabelac, S., Kamath, A., Kedzierski, M. A., Kieng, L. G., Kim, C., Kim, J., Kim, S., Lee, S. H., Leong, K. C., Manna, I., Michel, B., Ni, R., Patel, H. E., Philip, J., Poulikakos, D., Reynaud, C., Savino, R., Singh, P. K., Song, P., Sundararajan, T., Timofeeva, E., Tritcak, T., Turanov, A. N., Van Vaerenbergh, S., Wen, D., Witharana, S., Yang, C., Yeh, W., Zhao, X., Zhou, S. 2009; 106 (9)

    View details for DOI 10.1063/1.3245330

    View details for Web of Science ID 000272555700090

  • Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary Resistance IEEE TRANSACTIONS ON ADVANCED PACKAGING Pettes, A. M., Hodes, M. S., Goodson, K. E. 2009; 32 (2): 423-430

    View details for DOI 10.1109/TADVP.2008.924221

    View details for Web of Science ID 000266778000021

  • Convective Performance of Nanofluids in a Laminar Thermally Developing Tube Flow JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Kolade, B., Goodson, K. E., Eaton, J. K. 2009; 131 (5)

    View details for DOI 10.1115/1.3013831

    View details for Web of Science ID 000264374400011

  • Non-invasive measurement of void fraction and liquid temperature in microchannel flow boiling EXPERIMENTS IN FLUIDS Fogg, D., David, M., Goodson, K. E. 2009; 46 (4): 725-736

    View details for DOI 10.1007/s00348-008-0604-3

    View details for Web of Science ID 000265081300013

  • Multimode thermoelastic dissipation JOURNAL OF APPLIED PHYSICS Chandorkar, S. A., Candler, R. N., Duwel, A., Melamud, R., Agarwal, M., Goodson, K. E., Kenny, T. W. 2009; 105 (4)

    View details for DOI 10.1063/1.3072682

    View details for Web of Science ID 000263803300018

  • FLOW REGIME EVOLUTION IN LONG, SERPENTINE MICROCHANNELS WITH A POROUS CARBON PAPER WALL IMECE 2008: HEAT TRANSFER, FLUID FLOWS, AND THERMAL SYSTEMS, VOL 10, PTS A-C Steinbrenner, J. E., Lee, E. S., Wang, F., Fang, C., Hidrovo, C. H., Goodson, K. E. 2009: 773-781

    View details for Web of Science ID 000265085300094

  • THERMOELECTRIC HEAT RECOVERY FROM A TANKLESS WATER HEATING SYSTEM IMECE 2008: PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2008, VOL 8 LeBlanc, S. A., Gao, Y., Goodson, K. E. 2009: 131-137

    View details for Web of Science ID 000265684200014

  • Measurement of Anisotropy in the Thermal Conductivity of Ge2Sb2Te5 Films NVMTS: 2009 10TH ANNUAL NON-VOLATILE MEMORY TECHNOLOGY SYMPOSIUM Lee, J., Reifenberg, J. P., Li, Z., Hom, L., Asheghi, M., Kim, S., Wong, H. P., Goodson, K. E. 2009: 52-57

    View details for Web of Science ID 000278758600008

  • Thermal conductivity measurement and sedimentation detection of aluminum oxide nanofluids by using the 3 omega method INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW Oh, D., Jain, A., Eaton, J. K., Goodson, K. E., Lee, J. S. 2008; 29 (5): 1456-1461

    View details for DOI 10.1016/j.ijheatfluidflow.2008.04.007

    View details for Web of Science ID 000260645600021

  • Measurement of the thermal conductivity and heat capacity of freestanding shape memory thin films using the 3 omega method JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Jain, A., Goodson, K. E. 2008; 130 (10)

    View details for DOI 10.1115/1.2945904

    View details for Web of Science ID 000259854000011

  • The impact of thermal boundary resistance in phase-change memory devices IEEE ELECTRON DEVICE LETTERS Reifenberg, J. P., Kencke, D. L., Goodson, K. E. 2008; 29 (10): 1112-1114

    View details for DOI 10.1109/LED.2008.2003012

    View details for Web of Science ID 000259812900009

  • Diffusion, aggregation, and the thermal conductivity of nanofluids APPLIED PHYSICS LETTERS Gharagozloo, P. E., Eaton, J. K., Goodson, K. E. 2008; 93 (10)

    View details for DOI 10.1063/1.2977868

    View details for Web of Science ID 000259797000084

  • Investigation of the natural convection boundary condition in microfabricated structures INTERNATIONAL JOURNAL OF THERMAL SCIENCES Hu, X. J., Jain, A., Goodson, K. E. 2008; 47 (7): 820-824

    View details for DOI 10.1016/j.ijthermalsci.2007.07.011

    View details for Web of Science ID 000256576500002

  • 3-D numerical simulation of contact angle hysteresis for microscale two phase flow INTERNATIONAL JOURNAL OF MULTIPHASE FLOW Fang, C., Hidrovo, C., Wang, F., Eaton, J., Goodson, K. E. 2008; 34 (7): 690-705

    View details for DOI 10.1016/j.ijmultiphaseflow.2007.08.008

    View details for Web of Science ID 000258250300008

  • Thermal resistance between low-dimensional nanostructures and semi-infinite media JOURNAL OF APPLIED PHYSICS Panzer, M. A., Goodson, K. E. 2008; 103 (9)

    View details for DOI 10.1063/1.2903519

    View details for Web of Science ID 000255983200119

  • Thermal properties of metal-coated vertically aligned single-wall nanotube arrays JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Panzer, M. A., Zhang, G., Mann, D., Hu, X., Pop, E., Dai, H., Goodson, K. E. 2008; 130 (5)

    View details for DOI 10.1115/1.2885159

    View details for Web of Science ID 000255880300006

  • Fully coupled nonequilibrium electron-phonon transport in nanometer-scale silicon FETs IEEE TRANSACTIONS ON ELECTRON DEVICES Rowlette, J. A., Goodson, K. E. 2008; 55 (1): 220-232

    View details for DOI 10.1109/TED.2007.911043

    View details for Web of Science ID 000252059000019

  • Thermomechanical formation of nanoscale polymer indents with a heated silicon tip JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME King, W. P., Goodson, K. E. 2007; 129 (11): 1600-1604

    View details for DOI 10.1115/1.2764088

    View details for Web of Science ID 000251725700015

  • Thickness and stoichiometry dependence of the thermal conductivity of GeSbTe films APPLIED PHYSICS LETTERS Reifenberg, J. P., Panzer, M. A., Kim, S., Gibby, A. M., Zhang, Y., Wong, S., Wong, H. P., Pop, E., Goodson, K. E. 2007; 91 (11)

    View details for DOI 10.1063/1.2784169

    View details for Web of Science ID 000249474000022

  • Electrical and thermal transport in metallic single-wall carbon nanotubes on insulating substrates JOURNAL OF APPLIED PHYSICS Pop, E., Mann, D. A., Goodson, K. E., Dai, H. 2007; 101 (9)

    View details for DOI 10.1063/1.2717855

    View details for Web of Science ID 000246567900049

  • Materials science. Ordering up the minimum thermal conductivity of solids. Science Goodson, K. E. 2007; 315 (5810): 342-343

    View details for PubMedID 17234938

  • Infrared Microscopy Characterization of Opposing Carbon Nanotube Arrays ASME Journal of Heat Transfer Hu, X., Panzer, M., A., Goodson, K., E. 2007; 129: 91-93
  • Non-equilibrium phonon distributions in sub-100 nm silicon transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sinha, S., Pop, E., DUTTON, R. W., Goodson, K. E. 2006; 128 (7): 638-647

    View details for DOI 10.1115/1.2194041

    View details for Web of Science ID 000239047600003

  • A hybrid method for bubble geometry reconstruction in two-phase microchannels EXPERIMENTS IN FLUIDS Wang, E. N., Devasenathipathy, S., Lin, H., Hidrovo, C. H., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2006; 40 (6): 847-858

    View details for DOI 10.1007/s00348-006-0123-z

    View details for Web of Science ID 000239549100003

  • Two-phase microfluidics for semiconductor circuits and fuel cells HEAT TRANSFER ENGINEERING Hidrovo, C. H., Kramer, T. A., Wang, E. N., Vigneron, E., Steinbrenner, J. E., Koo, J. M., Wang, F. M., Fogg, D. W., Flynn, R. D., Lee, E. S., Cheng, C. H., Kenny, T. W., Eaton, J. K., Goodson, K. E. 2006; 27 (4): 53-63

    View details for DOI 10.1080/01457630500523816

    View details for Web of Science ID 000236239500006

  • Thermal conductance of an individual single-wall carbon nanotube above room temperature NANO LETTERS Pop, E., Mann, D., Wang, Q., Goodson, K. E., Dai, H. J. 2006; 6 (1): 96-100

    Abstract

    The thermal properties of a suspended metallic single-wall carbon nanotube (SWNT) are extracted from its high-bias (I-V) electrical characteristics over the 300-800 K temperature range, achieved by Joule self-heating. The thermal conductance is approximately 2.4 nW/K, and the thermal conductivity is nearly 3500 Wm(-1)K(-1) at room temperature for a SWNT of length 2.6 mum and diameter 1.7 nm. A subtle decrease in thermal conductivity steeper than 1/T is observed at the upper end of the temperature range, which is attributed to second-order three-phonon scattering between two acoustic modes and one optical mode. We discuss sources of uncertainty and propose a simple analytical model for the SWNT thermal conductivity including length and temperature dependence.

    View details for DOI 10.1021/nl052145f

    View details for Web of Science ID 000235532400018

    View details for PubMedID 16402794

  • Electro-thermal transport in silicon and carbon nanotube devices NONEQUILIBRIUM CARRIER DYNAMICS IN SEMICONDUCTORS PROCEEDINGS Pop, E., Mann, D., ROWLETTE, J., Goodson, K., Dai, H. 2006; 110: 195-199

    View details for Web of Science ID 000242486900044

  • Thermal and Molecular Stimulated Relaxation of Hot Phonons in Suspended Carbon Nanotubes Journal of Physical Chemistry B Mann, D., Pop, E., Cao, J., Wang, Q., Goodson, K., E., Dai, H. 2006; 110: 1502-1505
  • 3 omega Measurements of the Thermal Conductivity of Vertically Oriented Carbon Nanotubes on Silicon ASME Journal of Heat Transfer Hu, X., Padilla, A., A., Xu, J., Fisher, T., A., Goodson, K., E. 2006; 128: 1109-1113
  • Scaling analysis of multilevel interconnect temperatures for high-performance ICs IEEE TRANSACTIONS ON ELECTRON DEVICES Im, S., Srivastava, N., Banerjee, K., Goodson, K. E. 2005; 52 (12): 2710-2719

    View details for DOI 10.1109/TED.2005.859612

    View details for Web of Science ID 000233682200025

  • Negative differential conductance and hot phonons in suspended nanotube molecular wires PHYSICAL REVIEW LETTERS Pop, E., Mann, D., Cao, J., Wang, Q., Goodson, K. E., Dai, H. J. 2005; 95 (15)

    Abstract

    Freely suspended metallic single-walled carbon nanotubes (SWNTs) exhibit reduced current carrying ability compared to those lying on substrates, and striking negative differential conductance at low electric fields. Theoretical analysis reveals significant self-heating effects including electron scattering by hot nonequilibrium optical phonons. Electron transport characteristics under strong self-heating are exploited for the first time to probe the thermal conductivity of individual SWNTs (approximately 3600 W m-1 K-1 at T=300 K) up to approximately 700 K, and reveal a 1/T dependence expected for umklapp phonon scattering at high temperatures.

    View details for DOI 10.1103/PhysRevLett.95.155505

    View details for Web of Science ID 000232443400039

    View details for PubMedID 16241738

  • Managing heat for electronics MATERIALS TODAY Schelling, P. K., Shi, L., Goodson, K. E. 2005; 8 (6): 30-35

    View details for Web of Science ID 000208785200022

  • Phase change phenomena in silicon microchannels INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER Zhang, L. A., Wang, E. N., Goodson, K. E., Kenny, T. W. 2005; 48 (8): 1572-1582

    View details for DOI 10.1016/j.ijheatmasstransfer.2004.09.048

    View details for Web of Science ID 000228228400015

  • Monte Carlo simulation of Joule heating in bulk and strained silicon APPLIED PHYSICS LETTERS Pop, E., DUTTON, R. W., Goodson, K. E. 2005; 86 (8)

    View details for DOI 10.1063/1.1870106

    View details for Web of Science ID 000227609000032

  • Scattering of g-process longitudinal optical phonons at hotspots in silicon JOURNAL OF APPLIED PHYSICS Sinha, S., Schelling, P. K., Phillpot, S. R., Goodson, K. E. 2005; 97 (2)

    View details for DOI 10.1063/1.1831549

    View details for Web of Science ID 000226700500049

  • Bond line thickness of thermal interface materials with carbon nanotubes ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C Singaravelu, S. A., Hu, X., Goodson, K. E. 2005: 379-383

    View details for Web of Science ID 000241978200048

  • Thermal Conduction in Silicon Micro and Nanostructures Annual Review of Heat Transfer McConnell, A., D., Goodson, K., E. 2005; 14: 129-168
  • Managing Heat for Electronics Materials Today Shelling, P., Li, S., Goodson, K., E. 2005; 6: 30-35
  • Measurement of thermophysical properties of thin film shape memory alloys using the 3-omega method MICRO-ELECTRO-MECHANICAL SYSTEMS - 2005 Jain, A., Goodson, K. E. 2005; 7: 537-541

    View details for Web of Science ID 000243038100084

  • Review: Multiscale thermal modeling in nanoelectronics INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING Sinha, S., Goodson, K. E. 2005; 3 (1): 107-133

    View details for Web of Science ID 000235549800008

  • Micromachined jets for liquid impingement cooling of VLSI chips (vol 13, pg 833, 2004) JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (6): 1072-1072

    View details for DOI 10.1109/JMEMS.2004.840851

    View details for Web of Science ID 000225515100022

  • Analytic band Monte Carlo model for electron transport in Si including acoustic and optical phonon dispersion JOURNAL OF APPLIED PHYSICS Pop, E., DUTTON, R. W., Goodson, K. E. 2004; 96 (9): 4998-5005

    View details for DOI 10.1063/1.1788838

    View details for Web of Science ID 000224799300042

  • Micromachined jets for liquid impingement cooling of VLSI chips JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Wang, E. N., Zhang, L., Jiang, L. N., Koo, J. M., Maveety, J. G., Sanchez, E. A., Goodson, K. E., Kenny, T. W. 2004; 13 (5): 833-842

    View details for DOI 10.1109/JMEMS.2004.835768

    View details for Web of Science ID 000224413100014

  • Comparison of thermal and piezoresistive sensing approaches for atomic force microscopy topography measurements APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E. 2004; 85 (11): 2086-2088

    View details for DOI 10.1063/1.1787160

    View details for Web of Science ID 000223923300073

  • Nucleation and growth of vapor bubbles in a heated silicon microchannel JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Wang, E. N., Devasenathipathy, S., Santiago, J. G., Goodson, K. E., Kenny, T. W. 2004; 126 (4): 497-497

    View details for Web of Science ID 000223989100004

  • Convectively driven polymerase chain reaction thermal cycler ANALYTICAL CHEMISTRY Wheeler, E. K., Benett, W., Stratton, P., Richards, J., Chen, A., Christian, A., Ness, K. D., Ortega, J., Li, L. G., Weisgraber, T. H., Goodson, K. E., Milanovich, F. 2004; 76 (14): 4011-4016

    Abstract

    We have fabricated a low-cost disposable polymerase chain reaction thermal chamber that uses buoyancy forces to move the sample solution between the different temperatures necessary for amplification. Three-dimensional, unsteady finite element modeling and a simpler 1-D steady-state model are used together with digital particle image velocimetry data to characterize the flow within the device. Biological samples have been amplified using this novel thermal chamber. Time for amplification is less than 30 min. More importantly, an analysis of the energy consumption shows significant improvements over current technology.

    View details for DOI 10.1021/ac034941g

    View details for Web of Science ID 000222706400018

    View details for PubMedID 15253636

  • Electro-kinetic microchannel cooling system for servers ITHERM 2004, VOL 1 Upadhya, G., Zhou, P., Hom, J., Goodson, K., Munch, M. 2004: 367-371

    View details for Web of Science ID 000222478500052

  • Electro-kinetic microchannel cooling system for desktop computers TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004 Zhou, P., Hom, J., Upadhya, G., Goodson, K., Munch, M. 2004: 26-29

    View details for Web of Science ID 000189455400005

  • Thermal microscopy with a microfabricated solid immersion lens MICROSCALE THERMOPHYSICAL ENGINEERING Fletcher, D. A., Kino, G. S., Goodson, K. E. 2003; 7 (4): 267-273

    View details for DOI 10.1080/10893950390245985

    View details for Web of Science ID 000186732300001

  • Special Issue on emerging technologies - Foreword IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES Amon, C. H., Goodson, K. E., Luo, G. Q. 2003; 26 (2): 307-308

    View details for DOI 10.1109/TCAPT.2003.816231

    View details for Web of Science ID 000186046300001

  • Nanoscale thermal transport JOURNAL OF APPLIED PHYSICS Cahill, D. G., FORD, W. K., Goodson, K. E., Mahan, G. D., Majumdar, A., Maris, H. J., Merlin, R., Phillpot, S. R. 2003; 93 (2): 793-818

    View details for DOI 10.1063/1.1524305

    View details for Web of Science ID 000180134200001

  • Detailed heat generation simulations via the Monte Carlo method 2003 IEEE INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES Pop, E., Dutton, R., Goodson, K. 2003: 121-124

    View details for Web of Science ID 000185660800030

  • Design, fabrication and thermal characterization of a MEMS device for control of nerve cell growth MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) - 2003 Jain, A., Ness, K., McConnell, A., Jiang, L., Goodson, K. 2003: 251-257

    View details for Web of Science ID 000222633100040

  • Thermal conductivity model for nearly pure and doped thin silicon layers at high temperatures ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003 Asheghi, M., Goodson, K. E. 2003: 847-853

    View details for Web of Science ID 000222522400103

  • Closed-loop cooling technologies for microprocessors 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST Upadhya, G., Zhou, P., Goodson, K., Munch, M., Kenny, T. 2003: 775-778

    View details for Web of Science ID 000189158800177

  • Thermal analysis of ultra-thin body device scaling 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST Pop, E., Dutton, R., Goodson, K. 2003: 883-886

    View details for Web of Science ID 000189158800202

  • Design of atomic force microscope cantilevers for combined thermomechanical writing and thermal reading in array operation JOURNAL OF MICROELECTROMECHANICAL SYSTEMS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G. L., Despont, M., Durig, U. T., Rothuizen, H., Binnig, G., Vettiger, P. 2002; 11 (6): 765-774

    View details for DOI 10.1109/JMEMS.2002.803283

    View details for Web of Science ID 000179740900017

  • Thermal conduction in doped single-crystal silicon films JOURNAL OF APPLIED PHYSICS Asheghi, M., Kurabayashi, K., Kasnavi, R., Goodson, K. E. 2002; 91 (8): 5079-5088

    View details for DOI 10.1063/1.1458057

    View details for Web of Science ID 000174666600047

  • Thermometry and thermal transport in micro/nanoscale solid-state devices and structures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Cahill, D. G., Goodson, K. E., Majumdar, A. 2002; 124 (2): 223-241

    View details for DOI 10.1115/1.1454111

    View details for Web of Science ID 000175917200002

  • Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Zhang, L., Koo, J. M., Jiang, L., Asheghi, M., Goodson, K. E., Santiago, J. G., Kenny, T. W. 2002; 11 (1): 12-19

    View details for Web of Science ID 000173751000002

  • Modeling resist heating in mask fabrication using a multilayer Green's function approach. METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XVI, PTS 1 & 2 CHU, D. C., Pease, R. F., Goodson, K. E. 2002; 4689: 206-212

    View details for Web of Science ID 000178071700021

  • Electroosmotic Microchannel Cooling System for Microprocessors Electronics Cooling Goodson, K., E., Santiago, J., G., Kenny, T., Jiang, L., Zeng, S., Koo, J., M. 2002; 8: 46-47
  • Transient and sub-atmospheric performance of a closed-loop electroosmotic microchannel cooling system THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS Jiang, L., Mikkelsen, J., Koo, J. M., Zhang, L., Huber, D., Yao, S., Bari, A., Zhou, P., Santiago, J., Kenny, T., Goodson, K. E., Maveety, J., Prasher, R., Benning, S. 2002: 133-139

    View details for Web of Science ID 000181956000016

  • Microfabricated silicon solid immersion lens JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Fletcher, D. A., Crozier, K. B., Guarini, K. W., Minne, S. C., Kino, G. S., Quate, C. F., Goodson, K. E. 2001; 10 (3): 450-459

    View details for Web of Science ID 000170875900015

  • Thermal conductivity of doped polysilicon layers JOURNAL OF MICROELECTROMECHANICAL SYSTEMS McConnell, A. D., Uma, S., Goodson, K. E. 2001; 10 (3): 360-369

    View details for Web of Science ID 000170875900005

  • Subpixel displacement and deformation gradient measurement using digital image/speckle correlation (DISC) OPTICAL ENGINEERING Zhou, P., Goodson, K. E. 2001; 40 (8): 1613-1620

    View details for Web of Science ID 000170933100029

  • Thermal characterization of Bi2Te3/Sb2Te3 superlattices JOURNAL OF APPLIED PHYSICS Touzelbaev, M. N., Zhou, P., Venkatasubramanian, R., Goodson, K. E. 2001; 90 (2): 763-767

    View details for Web of Science ID 000169660000033

  • Refraction contrast imaging with a scanning microlens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2001; 78 (23): 3589-3591

    View details for Web of Science ID 000168996900007

  • Measurement of ballistic phonon conduction near hotspots in silicon APPLIED PHYSICS LETTERS Sverdrup, P. G., Sinha, S., Asheghi, M., Uma, S., Goodson, K. E. 2001; 78 (21): 3331-3333

    View details for Web of Science ID 000168721200057

  • A deterministic methodology for prediction of fracture distribution in basaltic multiflows JOURNAL OF GEOPHYSICAL RESEARCH-SOLID EARTH Lore, J., Aydin, A., Goodson, K. E. 2001; 106 (B4): 6447-6459

    View details for Web of Science ID 000167920500008

  • Focusing in microlenses close to a wavelength in diameter OPTICS LETTERS Fletcher, D. A., Goodson, K. E., Kino, G. S. 2001; 26 (7): 399-401

    Abstract

    Light focused from air into a spherical microlens is affected by diffraction at the lens surface as its diameter approaches the wavelength of light. Through an extension of Mie theory, we show that a converging wave that is incident upon a Si microlens with a diameter less than approximately 4lambda creates a spot as much as 25% smaller than predicted with vector diffraction theory. Si microlenses only a wavelength in diameter are shown to be virtually insensitive to variations in the maximum illumination angle, and changes in index of refraction are not found to cause the proportional changes in spot size that would be expected from vector diffraction theory.

    View details for Web of Science ID 000167774200001

    View details for PubMedID 18040333

  • Atomic force microscope cantilevers for combined thermomechanical data writing and reading APPLIED PHYSICS LETTERS King, W. P., Kenny, T. W., Goodson, K. E., Cross, G., Despont, M., Durig, U., Rothuizen, H., Binnig, G. K., Vettiger, P. 2001; 78 (9): 1300-1302

    View details for Web of Science ID 000167151000044

  • Sub-continuum simulations of heat conduction in silicon-on-insulator transistors JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Sverdrup, P. G., Ju, Y. S., Goodson, K. E. 2001; 123 (1): 130-137

    View details for Web of Science ID 000167368600016

  • Temperature Dependent Thermal Conductivity of Undoped Polycrystalline Silicon Layers International Journal of Thermophysics Uma, S., McConnell, A., D., Asheghi, M., Kurabayashi, K., Goodson, K., E. 2001; 22: 605-616
  • Near-field infrared imaging with a microfabricated solid immersion lens APPLIED PHYSICS LETTERS Fletcher, D. A., Crozier, K. B., Quate, C. F., Kino, G. S., Goodson, K. E., Simanovskii, D., Palanker, D. V. 2000; 77 (14): 2109-2111

    View details for Web of Science ID 000089524900010

  • Millipede - An AFM Data Storage System at the Frontier of Nanotribology Tribology Letters Durig, U., Cross, G., Despont, M., Drechsler, U., Haeberle, W., Lutwyche, M., I., Goodson, K. E. 2000; 9: 25-32
  • Thermomechanical diagnostics of BGA packages using digital image/speckle correlation ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS Zhou, P., Goodson, K. 2000: 240-245

    View details for Web of Science ID 000089141400036

  • "Millipede" - an AFM data storage system at the frontier of nanotribology TRIBOLOGY LETTERS Durig, U., Cross, G., Despont, M., Drechsler, U., Haberle, W., Lutwyche, M. I., Rothuizen, H., Stutz, R., Widmer, R., Vettiger, P., Binnig, G. K., King, W. P., Goodson, K. E. 2000; 9 (1-2): 25-32

    View details for Web of Science ID 000167678500004

  • Impact of molecular orientation on thermal conduction in spin-coated polyimide films JOURNAL OF APPLIED PHYSICS Kurabayashi, K., Goodson, K. E. 1999; 86 (4): 1925-1931

    View details for Web of Science ID 000081720600022

  • Intrinsic-carrier thermal runaway in silicon microcantilevers MICROSCALE THERMOPHYSICAL ENGINEERING Chui, B. W., Asheghi, M., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J. 1999; 3 (3): 217-228

    View details for Web of Science ID 000082536200006

  • Measurement of the thermal conductivity anisotropy in polyimide films JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Kurabayashi, K., Asheghi, M., Touzelbaev, M., Goodson, K. E. 1999; 8 (2): 180-191

    View details for Web of Science ID 000080737300007

  • Phonon scattering in silicon films with thickness of order 100 nm APPLIED PHYSICS LETTERS Ju, Y. S., Goodson, K. E. 1999; 74 (20): 3005-3007

    View details for Web of Science ID 000080352700033

  • Process-dependent thermal transport properties of silicon-dioxide films deposited using low-pressure chemical vapor deposition JOURNAL OF APPLIED PHYSICS Ju, Y. S., Goodson, K. E. 1999; 85 (10): 7130-7134

    View details for Web of Science ID 000080136000019

  • Thermal characterization of anisotropic thin dielectric films using harmonic Joule heating THIN SOLID FILMS Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1999; 339 (1-2): 160-164

    View details for Web of Science ID 000079008300027

  • Heat conduction in novel electronic films ANNUAL REVIEW OF MATERIALS SCIENCE Goodson, K. E., Ju, Y. S. 1999; 29: 261-293

    View details for Web of Science ID 000082534400009

  • Phonon Scattering in Silicon Films of Thickness Below 100 nm Applied Physics Letters Ju, Y., S., Goodson, K., E. 1999; 74: 3005-3007
  • Impact of Molecular Orientation on Thermal Conduction in Spin-Coated Polyimide Films Journal of Applied Physics Kurabayashi, K., Goodson, K., E. 1999; 86: 1925-1931
  • Transient liquid crystal thermometry of microfabricated PCR vessel arrays JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chaudhari, A. M., Woudenberg, T. M., Albin, M., Goodson, K. E. 1998; 7 (4): 345-355

    View details for Web of Science ID 000077401800001

  • Precision measurement and mapping of die-attach thermal resistance IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A Kurabayashi, K., Goodson, K. E. 1998; 21 (3): 506-514

    View details for Web of Science ID 000076416500015

  • Short-time-scale thermal mapping of microdevices using a scanning thermoreflectance technique JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Ju, Y. S., Goodson, K. E. 1998; 120 (2): 306-313

    View details for Web of Science ID 000074007000002

  • Thermal characterization of IC passivation layers using Joule heating and optical thermometry MICROSCALE THERMOPHYSICAL ENGINEERING Ju, Y. S., Kurabayashi, K., Goodson, K. E. 1998; 2 (2): 101-110

    View details for Web of Science ID 000074152500004

  • Low-stiffness silicon cantilevers with integrated heaters and piezoresistive sensors for high-density AFM thermomechanical data storage JOURNAL OF MICROELECTROMECHANICAL SYSTEMS Chui, B. W., Stowe, T. D., Ju, Y. S., Goodson, K. E., Kenny, T. W., Mamin, H. J., Terris, B. D., Ried, R. P., Rugar, D. 1998; 7 (1): 69-78

    View details for Web of Science ID 000073005900009

  • Applications of micron-scale passive diamond layers for the integrated circuits and microelectromechanical systems industries DIAMOND AND RELATED MATERIALS Touzelbaev, M. N., Goodson, K. E. 1998; 7 (1): 1-14

    View details for Web of Science ID 000072061900001

  • Short-Time-Scale Thermal Mapping of Microdevices using a Scanning Thermoreflectance Technique ASME Journal of Heat Transfer Ju, Y., S., Goodson, K., E. 1998; 120: 306-313
  • Precision Measurement and Mapping of Die-Attach Thermal Resistance IEEE Transactions on Components, Packaging, and Manufacturing Technology Kurabayashi, K., Goodson, K., E. 1998; A21: 506-514
  • Thermal mapping of interconnects subjected to brief electrical stresses IEEE ELECTRON DEVICE LETTERS Ju, Y. S., Goodson, K. E. 1997; 18 (11): 512-514

    View details for Web of Science ID A1997YD00300002

  • Impact of nucleation density on thermal resistance near diamond-substrate boundaries JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER Touzelbaev, M. N., Goodson, K. E. 1997; 11 (4): 506-512

    View details for Web of Science ID A1997YA62200003

  • Phonon-boundary scattering in thin silicon layers APPLIED PHYSICS LETTERS Asheghi, M., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 71 (13): 1798-1800

    View details for Web of Science ID A1997XY99300018

  • Heating mechanisms of LDMOS and LIGBT in ultrathin SOI IEEE ELECTRON DEVICE LETTERS Leung, Y. K., Paul, A. K., Goodson, K. E., Plummer, J. D., Wong, S. S. 1997; 18 (9): 414-416

    View details for Web of Science ID A1997XR89300004

  • Size effect on thermal conduction in silicon-on-insulator devices under electrostatic discharge (ESD) conditions JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS Ju, Y. S., Goodson, K. E. 1997; 36 (6B): L798-L800

    View details for Web of Science ID A1997XG03200021

  • Short-timescale thermal mapping of semiconductor devices IEEE ELECTRON DEVICE LETTERS Ju, Y. S., KADING, O. W., Leung, Y. K., Wong, S. S., Goodson, K. E. 1997; 18 (5): 169-171

    View details for Web of Science ID A1997WU99600001

  • Improved heat sinking for laser-diode arrays using microchannels in CVD diamond IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING Goodson, K. E., Kurabayashi, K., Pease, R. F. 1997; 20 (1): 104-109

    View details for Web of Science ID A1997WH03400014

  • Thermal conductivity measurements of interlevel dielectrics MATERIALS RELIABILITY IN MICROELECTRONICS VII VARNER, E. B., Marieb, T., Mack, A. S., Lee, J., MEYER, W. K., Goodson, K. E. 1997; 473: 279-284

    View details for Web of Science ID A1997BJ82V00038

  • Thermal conduction in nonhomogeneous CVD diamond layers in electronic microstructures JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E. 1996; 118 (2): 279-286

    View details for Web of Science ID A1996UQ31000001

  • PREDICTION AND MEASUREMENT OF TEMPERATURE-FIELDS IN SILICON-ON-INSULATOR ELECTRONIC-CIRCUITS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1995; 117 (3): 574-581

    View details for Web of Science ID A1995RX54700003

  • THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES APPLIED PHYSICS LETTERS Goodson, K. E., KADING, O. W., Rosner, M., Zachai, R. 1995; 66 (23): 3134-3136

    View details for Web of Science ID A1995RB34700017

  • EXPERIMENTAL INVESTIGATION OF THERMAL CONDUCTION NORMAL TO DIAMOND-SILICON BOUNDARIES JOURNAL OF APPLIED PHYSICS Goodson, K. E., KADING, O. W., Rosler, M., Zachai, R. 1995; 77 (4): 1385-1392

    View details for Web of Science ID A1995QG50000004

  • THERMAL CONDUCTION IN METALLIZED SILICON-DIOXIDE LAYERS ON SILICON APPLIED PHYSICS LETTERS KADING, O. W., SKURK, H., Goodson, K. E. 1994; 65 (13): 1629-1631

    View details for Web of Science ID A1994PH33200009

  • PREDICTION AND MEASUREMENT OF THE THERMAL-CONDUCTIVITY OF AMORPHOUS DIELECTRIC LAYERS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I., Su, L. T., Antoniadis, D. A. 1994; 116 (2): 317-324

    View details for Web of Science ID A1994NP56200005

  • Measurement and Modeling of Self-Heating in SOI nMOSFETS IEEE Transactions on Electron Devices Su, L., T., Chung, J., E., Antoniadis, D., A., Goodson, K., E., Flik, M., I. 1994; 41: 69-75
  • MEASUREMENT AND MODELING OF SELF-HEATING IN SOI NMOSFETS IEEE TRANSACTIONS ON ELECTRON DEVICES Su, L. T., Chung, J. E., Antoniadis, D. A., Goodson, K. E., Flik, M. I. 1994; 41 (1): 69-75

    View details for Web of Science ID A1994MU75400011

  • Thermal Conduction Processes with Sub-Micrometer Lengthscales in Electronic Circuits Thermal Science and Engineering Goodson, K., E., Flik, M., I. 1994; 2: 191-201
  • Prediction and Measurement of the Thermal Conductivity of Amorphous Dielectric Layers ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1994; 116: 317-324
  • Solid-Layer Thermal-Conductivity Measurement Techniques Applied Mechanics Reviews Goodson, K., E., Flik, M., I. 1994; 47: 101-112
  • Thermal Conduction in Metallized Silicon-Dioxide Layers on Silicon Applied Physics Letters Kading, O., W., Skurk, H., Goodson, K., E. 1994; 65: 1629-1631
  • INTRINSIC SUPERCONDUCTING RADIATION DETECTOR APPLIED PHYSICS LETTERS Flik, M. I., Zhang, Z. M., Goodson, K. E. 1993; 62 (22): 2862-2864

    View details for Web of Science ID A1993LE35300041

  • ELECTRON AND PHONON THERMAL CONDUCTION IN EPITAXIAL HIGH-TC SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Goodson, K. E., Flik, M. I. 1993; 115 (1): 17-25

    View details for Web of Science ID A1993KP91000003

  • Annealing-Temperature Dependence of the Thermal Conductivity of LPCVD Silicon-Dioxide Layers IEEE Electron Device Letters Goodson, K., E., Flik, M., I., Su, L., T., Antoniadis, D., A. 1993; 14: 490-492
  • Intrinsic Superconducting Radiation Detector Applied Physics Letters Flik, M., I., Zhang, Z., Z., Goodson, K., E. 1993; 62: 2862-2864
  • Electron and Phonon Thermal Conduction in Epitaxial High-Tc Superconducting Films ASME Journal of Heat Transfer Goodson, K., E., Flik, M., I. 1993; 115: 17-25
  • EFFECT OF MICROSCALE THERMAL CONDUCTION ON THE PACKING LIMIT OF SILICON-ON-INSULATOR ELECTRONIC DEVICES IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY Goodson, K. E., Flik, M. I. 1992; 15 (5): 715-722

    View details for Web of Science ID A1992KD69800014

  • HEAT-TRANSFER REGIMES IN MICROSTRUCTURES JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Choi, B. I., Goodson, K. E. 1992; 114 (3): 666-674

    View details for Web of Science ID A1992JL49100017

  • THERMAL-ANALYSIS OF ELECTRON-BEAM ABSORPTION IN LOW-TEMPERATURE SUPERCONDUCTING FILMS JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME Flik, M. I., Goodson, K. E. 1992; 114 (1): 264-270

    View details for Web of Science ID A1992HP76200035

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